P

Inventor

SHIH TSU

TW59 patents

Patents

50 patents
US6020263AFeb 1, 2000

Method of recovering alignment marks after chemical mechanical polishing of tungsten

TAIWAN SEMICONDUCTOR MFG295 citations99
US6398627B1Jun 4, 2002

Slurry dispenser having multiple adjustable nozzles

TAIWAN SEMICONDUCTOR MFG57 citations96
US6391780B1May 21, 2002

Method to prevent copper CMP dishing

TAIWAN SEMICONDUCTOR MFG78 citations96
US6228760B1May 8, 2001

Use of PE-SiON or PE-OXIDE for contact or via photo and for defect reduction with oxide and W chemical-mechanical polish

TAIWAN SEMICONDUCTOR MFG46 citations96
US6118185ASep 12, 2000

Segmented box-in-box for improving back end overlay measurement

TAIWAN SEMICONDUCTOR MFG80 citations96
US6821896B1Nov 23, 2004

Method to eliminate via poison effect

TAIWAN SEMICONDUCTOR MFG29 citations93
US6736701B1May 18, 2004

Eliminate broken line damage of copper after CMP

TAIWAN SEMICONDUCTOR MFG29 citations93
US6495452B1Dec 17, 2002

Method to reduce capacitance for copper interconnect structures

TAIWAN SEMICONDUCTOR MFG53 citations93
US6443810B1Sep 3, 2002

Polishing platen equipped with guard ring for chemical mechanical polishing

TAIWAN SEMICONDUCTOR MFG30 citations93
US6429118B1Aug 6, 2002

Elimination of electrochemical deposition copper line damage for damascene processing

TAIWAN SEMICONDUCTOR MFG40 citations93
US6383935B1May 7, 2002

Method of reducing dishing and erosion using a sacrificial layer

TAIWAN SEMICONDUCTOR MFG45 citations93
US6153526ANov 28, 2000

Method to remove residue in wolfram CMP

TAIWAN SEMICONDUCTOR MFG25 citations93
US6080656AJun 27, 2000

Method for forming a self-aligned copper structure with improved planarity

TAIWAN SEMICONDUCTOR MFG46 citations93
US5827782AOct 27, 1998

Multiple etch method for optimizing Inter-Metal Dielectric (IMD) spacer layer profile

TAIWAN SEMICONDUCTOR MFG20 citations93
US6620725B1Sep 16, 2003

Reduction of Cu line damage by two-step CMP

TAIWAN SEMICONDUCTOR MFG32 citations92
US6227947B1May 8, 2001

Apparatus and method for chemical mechanical polishing metal on a semiconductor wafer

TAIWAN SEMICONDUCTOR MFG35 citations92
US6020249AFeb 1, 2000

Method for photo alignment after CMP planarization

TAIWAN SEMICONDUCTOR MFG20 citations92
US5933744AAug 3, 1999

Alignment method for used in chemical mechanical polishing process

TAIWAN SEMICONDUCTOR MFG53 citations92
US5923996AJul 13, 1999

Method to protect alignment mark in CMP process

TAIWAN SEMICONDUCTOR MFG31 citations92
US5858854AJan 12, 1999

Method for forming high contrast alignment marks

TAIWAN SEMICONDUCTOR MFG27 citations92
US5709755AJan 20, 1998

Method for CMP cleaning improvement

TAIWAN SEMICONDUCTOR MFG27 citations92
US5654234AAug 5, 1997

Method for forming a void-free tungsten-plug contact in the presence of a contact opening overhang

TAIWAN SEMICONDUCTOR MFG42 citations92
US6518166B1Feb 11, 2003

Liquid phase deposition of a silicon oxide layer for use as a liner on the surface of a dual damascene opening in a low dielectric constant layer

TAIWAN SEMICONDUCTOR MFG41 citations91
US6458689B2Oct 1, 2002

Use of PE-SiON or PE-Oxide for contact or via photo and for defect reduction with oxide and w chemical-mechanical polish

TAIWAN SEMICONDUCTOR MFG20 citations90
US6372632B1Apr 16, 2002

Method to eliminate dishing of copper interconnects by the use of a sacrificial oxide layer

TAIWAN SEMICONDUCTOR MFG37 citations90
US6726535B2Apr 27, 2004

Method for preventing localized Cu corrosion during CMP

TAIWAN SEMICONDUCTOR MFG23 citations89
US6767833B2Jul 27, 2004

Method for damascene reworking

TAIWAN SEMICONDUCTOR MFG14 citations84
US6682396B1Jan 27, 2004

Apparatus and method for linear polishing

TAIWAN SEMICONDUCTOR MFG15 citations84
US6638328B1Oct 28, 2003

Bimodal slurry system

TAIWAN SEMICONDUCTOR MFG14 citations84
US6634930B1Oct 21, 2003

Method and apparatus for preventing metal corrosion during chemical mechanical polishing

TAIWAN SEMICONDUCTOR MFG14 citations84
US6358119B1Mar 19, 2002

Way to remove CU line damage after CU CMP

TAIWAN SEMICONDUCTOR MFG15 citations84
US6599838B1Jul 29, 2003

Method for forming metal filled semiconductor features to improve a subsequent metal CMP process

TAIWAN SEMICONDUCTOR MFG14 citations82
US6589852B1Jul 8, 2003

Method of replicating alignment marks for semiconductor wafer photolithography

TAIWAN SEMICONDUCTOR MFG13 citations82
US5972798AOct 26, 1999

Prevention of die loss to chemical mechanical polishing

TAIWAN SEMICONDUCTOR MFG16 citations82
US6589872B1Jul 8, 2003

Use of low-high slurry flow to eliminate copper line damages

TAIWAN SEMICONDUCTOR MFG8 citations74
US6501186B1Dec 31, 2002

Bond pad having variable density via support and method for fabrication

TAIWAN SEMICONDUCTOR MFG11 citations74
US6465897B1Oct 15, 2002

Method for photo alignment after CMP planarization

TAIWAN SEMICONDUCTOR MFG8 citations74
US6417106B1Jul 9, 2002

Underlayer liner for copper damascene in low k dielectric

TAIWAN SEMICONDUCTOR MFG11 citations74
US6350680B1Feb 26, 2002

Pad alignment for AlCu pad for copper process

TAIWAN SEMICONDUCTOR MFG12 citations74
US6156660ADec 5, 2000

Method of planarization using dummy leads

TAIWAN SEMICONDUCTOR MFG13 citations74
US5919714AJul 6, 1999

Segmented box-in-box for improving back end overlay measurement

TAIWAN SEMICONDUCTOR MFG14 citations74
US5773196AJun 30, 1998

Prevention of anti-reflection coating damage

TAIWAN SEMICONDUCTOR MFG11 citations74
US5641382AJun 24, 1997

Method to remove residue of metal etch

TAIWAN SEMICONDUCTOR MFG11 citations74
US5661084AAug 26, 1997

Method for contact profile improvement

TAIWAN SEMICONDUCTOR MFG8 citations73
US6686284B2Feb 3, 2004

Chemical mechanical polisher equipped with chilled retaining ring and method of using

TAIWAN SEMICONDUCTOR MFG8 citations71
US6833323B2Dec 21, 2004

Method for forming patterned features at a semiconductor wafer periphery to prevent metal peeling

TAIWAN SEMICONDUCTOR MFG11 citations66
US6635211B2Oct 21, 2003

Reinforced polishing pad for linear chemical mechanical polishing and method for forming

TAIWAN SEMICONDUCTOR MFG3 citations63
US6602780B2Aug 5, 2003

Method for protecting sidewalls of etched openings to prevent via poisoning

TAIWAN SEMICONDUCTOR MFG4 citations63
US6544891B1Apr 8, 2003

Method to eliminate post-CMP copper flake defect

TAIWAN SEMICONDUCTOR MFG4 citations63
US6515366B1Feb 4, 2003

Reduction of metal corrosion in semiconductor devices

TAIWAN SEMICONDUCTOR MFG3 citations63

Showing the top 50 of 59 patents by PatentIndex Score.