Inventor
HAU-RIEGE STEFAN
US12 patents
⚠️ This page may combine multiple inventors who share the name “HAU-RIEGE STEFAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
6 patentsUS6667225B2Dec 23, 2003
Wafer-bonding using solder and method of making the same
INTEL CORP68 citations95
US6579795B1Jun 17, 2003
Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability
INTEL CORP14 citations83
US7153774B2Dec 26, 2006
Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability
INTEL CORP14 citations80
US6833321B2Dec 21, 2004
Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability
INTEL CORP10 citations73
US6870262B2Mar 22, 2005
Wafer-bonding using solder and method of making the same
INTEL CORP2 citations62
US7300871B2Nov 27, 2007
Method of doping a conductive layer near a via
INTEL CORP1 citations52
ADVANCED MICRO DEVICES INC
3 patentsUS6822473B1Nov 23, 2004
Determination of permeability of layer material within interconnect
ADVANCED MICRO DEVICES INC28 citations92
US6762597B1Jul 13, 2004
Structure, system, and method for assessing electromigration permeability of layer material within interconnect
ADVANCED MICRO DEVICES INC25 citations92
US6768323B1Jul 27, 2004
System and method for determining location of extrusion in interconnect
ADVANCED MICRO DEVICES INC3 citations62