Inventor
OHARA HIROSHI
TW34 patents
⚠️ This page may combine multiple inventors who share the name “OHARA HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
OHARA HIROSHI
14 patentsUS8813906B2Aug 26, 2014
Speaker damper and manufacturing method of the same
OHARA HIROSHI7 citations84
US9693144B1Jun 27, 2017
Damper having a locally coated material and its fabrication method
OHARA HIROSHI2 citations73
US7724913B2May 25, 2010
Composite damper for speaker
OHARA HIROSHI7 citations73
US7200240B2Apr 3, 2007
Loudspeaker spider with enhanced structure
OHARA HIROSHI6 citations73
US10645510B2May 5, 2020
Manufacturing method of a speaker vibrating diaphragm by controlling a ratio of fiber materials
OHARA HIROSHI1 citations62
US9347173B1May 24, 2016
Method of manufacturing a damper for a loudspeaker
OHARA HIROSHI2 citations62
US7706562B2Apr 27, 2010
Corrugated damper for speaker
OHARA HIROSHI4 citations62
US7606387B2Oct 20, 2009
Loudspeaker cone including plated fabric
OHARA HIROSHI2 citations62
US7346183B2Mar 18, 2008
Spider with lead wires sandwiched
OHARA HIROSHI5 citations62
US10587955B2Mar 10, 2020
Speaker vibrating member and method of making the same
OHARA HIROSHI0 citations52
US10119206B2Nov 6, 2018
Speaker diaphragm fabric and manufacturing method thereof
OHARA HIROSHI1 citations52
US7734056B2Jun 8, 2010
Damper structure of preventing irregular vibration for speaker
OHARA HIROSHI1 citations52
US10225658B2Mar 5, 2019
Elastic composite structure for speaker vibrating member
OHARA HIROSHI0 citations41
US9516422B2Dec 6, 2016
Weaving method for a damper of a loudspeaker
OHARA HIROSHI0 citations41
SEIKO EPSON CORP
7 patentsUS5119216AJun 2, 1992
Electro-optical device
SEIKO EPSON CORP29 citations93
US6924553B2Aug 2, 2005
Semiconductor chip and wiring board with bumps formed on pads/land and on passivation/insulation film and manufacturing method of the same
SEIKO EPSON CORP21 citations92
US5317434AMay 31, 1994
Color filter structure for liquid crystal displays with seal end on or surrounded by orientation film
SEIKO EPSON CORP33 citations92
US5367393ANov 22, 1994
Electro-optical apparatus with metal light shield and conductor between color filters
SEIKO EPSON CORP34 citations90
US7067423B2Jun 27, 2006
Electroless plating apparatus, semiconductor wafer having bumps, semiconductor chip having bumps, methods of manufacturing the semiconductor wafer and the semiconductor chip, semiconductor device, circuit board, and electronic equipment
SEIKO EPSON CORP8 citations74
US6806556B2Oct 19, 2004
Semiconductor wafer, method of manufacturing semiconductor wafer having bumps, semiconductor chip having bumps and method of manufacturing the same, semiconductor device, circuit board, and electronic equipment
SEIKO EPSON CORP10 citations74
US7544598B2Jun 9, 2009
Semiconductor device and method of manufacturing the same
SEIKO EPSON CORP0 citations52
ALPS ALPINE CO LTD
5 patentsUS12154731B2Nov 26, 2024
Push switch and push switch system
ALPS ALPINE CO LTD2 citations73
US12094665B2Sep 17, 2024
Push switch
ALPS ALPINE CO LTD2 citations73
US11430618B2Aug 30, 2022
Push switch
ALPS ALPINE CO LTD2 citations71
US12537149B2Jan 27, 2026
Input device
ALPS ALPINE CO LTD0 citations57
US11961687B2Apr 16, 2024
Push switch
ALPS ALPINE CO LTD0 citations51
ALPS ELECTRIC CO LTD
3 patentsUS6995650B2Feb 7, 2006
Electrical part prevented from improper mounting on circuit board, and mounting structure for the electrical part
ALPS ELECTRIC CO LTD7 citations70
US10242817B2Mar 26, 2019
Switch housing protrusion secures board with fixed contact
ALPS ELECTRIC CO LTD0 citations52
US8833179B2Sep 16, 2014
Pressing type input device
ALPS ELECTRIC CO LTD1 citations52