Inventor
SEKIGUCHI JUNNOSUKE
JP22 patents
⚠️ This page may combine multiple inventors who share the name “SEKIGUCHI JUNNOSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON MINING CO
5 patentsUS7138040B2Nov 21, 2006
Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode
NIPPON MINING CO12 citations82
US7799188B2Sep 21, 2010
Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode
NIPPON MINING CO6 citations73
US7648621B2Jan 19, 2010
Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion
NIPPON MINING CO4 citations73
US7968150B2Jun 28, 2011
Method of surface treatment using imidazole compound
NIPPON MINING CO2 citations61
US8004082B2Aug 23, 2011
Electronic component formed with barrier-seed layer on base material
NIPPON MINING CO0 citations51
ITO JUNICHI
4 patentsUS8736057B2May 27, 2014
Substrate and manufacturing method therefor
ITO JUNICHI0 citations51
US8395264B2Mar 12, 2013
Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power
ITO JUNICHI0 citations51
US8283051B2Oct 9, 2012
Plated product having copper thin film formed thereon by electroless plating
ITO JUNICHI1 citations51
US8247301B2Aug 21, 2012
Substrate and manufacturing method therefor
ITO JUNICHI0 citations51
SEKIGUCHI JUNNOSUKE
3 patentsUS8089154B2Jan 3, 2012
Electronic component formed with barrier-seed layer on base material
SEKIGUCHI JUNNOSUKE1 citations49
US8390123B2Mar 5, 2013
ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer
SEKIGUCHI JUNNOSUKE0 citations47
US8333834B2Dec 18, 2012
High-purity aqueous copper sulfonate solution and method of producing same
SEKIGUCHI JUNNOSUKE0 citations46
YABE ATSUSHI
3 patentsUS8404035B2Mar 26, 2013
Electroless copper plating solution
YABE ATSUSHI0 citations46
US8394508B2Mar 12, 2013
Plated article having metal thin film formed by electroless plating
YABE ATSUSHI0 citations39
US8163400B2Apr 24, 2012
Plated article having metal thin film formed by electroless plating, and manufacturing method thereof
YABE ATSUSHI0 citations39