P

Inventor

LEE SHIH-PING

TW44 patents
⚠️ This page may combine multiple inventors who share the name “LEE SHIH-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

POWERCHIP SEMICONDUCTOR MFG CORP

24 patents
US11264322B2Mar 1, 2022

Semiconductor structure and manufacturing method thereof

POWERCHIP SEMICONDUCTOR MFG CORP2 citations67
US11955495B2Apr 9, 2024

Image sensing module

POWERCHIP SEMICONDUCTOR MFG CORP0 citations61
US11563047B2Jan 24, 2023

Image sensing module

POWERCHIP SEMICONDUCTOR MFG CORP0 citations61
US12588513B2Mar 24, 2026

Physical unclonable function generator structure and operation method thereof

POWERCHIP SEMICONDUCTOR MFG CORP0 citations60
US12438037B2Oct 7, 2025

Manufacturing method of semiconductor structure

POWERCHIP SEMICONDUCTOR MFG CORP0 citations60
US11367728B2Jun 21, 2022

Memory structure

POWERCHIP SEMICONDUCTOR MFG CORP0 citations60
US11367727B2Jun 21, 2022

Memory structure

POWERCHIP SEMICONDUCTOR MFG CORP0 citations60
US11527564B2Dec 13, 2022

Manufacturing method of image sensor

POWERCHIP SEMICONDUCTOR MFG CORP0 citations58
US10937819B2Mar 2, 2021

Image sensor and manufacturing method therefore

POWERCHIP SEMICONDUCTOR MFG CORP0 citations58
US12463043B2Nov 4, 2025

Wafer processing method

POWERCHIP SEMICONDUCTOR MFG CORP0 citations57
US12433052B2Sep 30, 2025

Image sensor structure

POWERCHIP SEMICONDUCTOR MFG CORP1 citations57
US11749699B2Sep 5, 2023

Solid-state image sensor with pillar surface microstructure and method of fabricating the same

POWERCHIP SEMICONDUCTOR MFG CORP0 citations57
US11688683B2Jun 27, 2023

Semiconductor structure and manufacturing method thereof

POWERCHIP SEMICONDUCTOR MFG CORP0 citations57
US11424280B2Aug 23, 2022

Solid-state image sensor with pillar surface microstructure and method of fabricating the same

POWERCHIP SEMICONDUCTOR MFG CORP0 citations57
US12261149B2Mar 25, 2025

Manufacturing method of semiconductor structure

POWERCHIP SEMICONDUCTOR MFG CORP0 citations54
US11069715B2Jul 20, 2021

Memory structure

POWERCHIP SEMICONDUCTOR MFG CORP0 citations51
US12564017B2Feb 24, 2026

Wafer stacking method

POWERCHIP SEMICONDUCTOR MFG CORP0 citations50
US12199179B2Jan 14, 2025

LDMOS with polysilicon deep drain

POWERCHIP SEMICONDUCTOR MFG CORP0 citations50
US10868017B2Dec 15, 2020

Memory structure and manufacturing method thereof

POWERCHIP SEMICONDUCTOR MFG CORP0 citations50
US11152367B1Oct 19, 2021

Semiconductor structure and integrated circuit

POWERCHIP SEMICONDUCTOR MFG CORP0 citations49
US12324170B2Jun 3, 2025

Capacitor structure and manufacturing method thereof

POWERCHIP SEMICONDUCTOR MFG CORP0 citations47
US12354961B2Jul 8, 2025

Semiconductor structure and manufacturing method thereof

POWERCHIP SEMICONDUCTOR MFG CORP0 citations43
US11152370B2Oct 19, 2021

Memory structure having transistors and capacitor and manufacturing method thereof

POWERCHIP SEMICONDUCTOR MFG CORP0 citations43
US11715669B2Aug 1, 2023

Through silicon via and method of manufacturing the same

POWERCHIP SEMICONDUCTOR MFG CORP0 citations39

IND TECH RES INST

8 patents

(unassigned)

4 patents

POWERCHIP TECHNOLOGY CORP

2 patents

LEE SHIH PING

2 patents

MAXTEC PLASTICS INC

2 patents

PROKIA TECHNOLOGY CO LTD

1 patent

DARJUNG IND CO LTD

1 patent