Inventor
EVERS SVEN
US25 patents
⚠️ This page may combine multiple inventors who share the name “EVERS SVEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
24 patentsUS6709967B2Mar 23, 2004
Laser wire bonding for wire embedded dielectrics to integrated circuits
MICRON TECHNOLOGY INC49 citations96
US5810926ASep 22, 1998
Method and apparatus for applying atomized adhesive to a leadframe for chip bonding
MICRON TECHNOLOGY INC42 citations96
US5962862AOct 5, 1999
Method and apparatus for verifying the presence or absence of a component
MICRON TECHNOLOGY INC43 citations92
US5874322AFeb 23, 1999
Method and apparatus for applying atomized adhesive to a leadframe for chip bonding
MICRON TECHNOLOGY INC18 citations92
US6159609ADec 12, 2000
Method and apparatus for applying atomized adhesive to a leadframe for chip bonding
MICRON TECHNOLOGY INC13 citations82
US5956607ASep 21, 1999
Laser wire bonding for wire embedded dielectrics to integrated circuits
MICRON TECHNOLOGY INC14 citations82
US5731244AMar 24, 1998
Laser wire bonding for wire embedded dielectrics to integrated circuits
MICRON TECHNOLOGY INC14 citations82
US6138891AOct 31, 2000
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
MICRON TECHNOLOGY INC10 citations81
US6126062AOct 3, 2000
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
MICRON TECHNOLOGY INC9 citations81
US6105846AAug 22, 2000
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
MICRON TECHNOLOGY INC15 citations81
US6390853B2May 21, 2002
Laser wire bonding for wire embedded dielectrics to integrated circuits
MICRON TECHNOLOGY INC7 citations74
US6030711AFeb 29, 2000
Method and apparatus for applying atomized adhesive to a leadframe for chip bonding
MICRON TECHNOLOGY INC6 citations74
US6001725ADec 14, 1999
Laser wire bonding for wire embedded dielectrics to integrated circuits
MICRON TECHNOLOGY INC3 citations74
US5996805ADec 7, 1999
Lead frame casing
MICRON TECHNOLOGY INC7 citations74
US5872405AFeb 16, 1999
Laser wire bonding for wire embedded dielectrics to integrated circuits
MICRON TECHNOLOGY INC4 citations74
US5836454ANov 17, 1998
Lead frame casing
MICRON TECHNOLOGY INC14 citations74
US6921017B2Jul 26, 2005
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
MICRON TECHNOLOGY INC3 citations73
US6588649B2Jul 8, 2003
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
MICRON TECHNOLOGY INC5 citations73
US6375061B1Apr 23, 2002
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
MICRON TECHNOLOGY INC5 citations73
US6352191B1Mar 5, 2002
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
MICRON TECHNOLOGY INC6 citations73
US6129039AOct 10, 2000
Apparatus for applying atomized adhesive to a leadframe for chip bonding
MICRON TECHNOLOGY INC4 citations63
US6634538B2Oct 21, 2003
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
MICRON TECHNOLOGY INC4 citations62
US6211053B1Apr 3, 2001
Laser wire bonding for wire embedded dielectrics to integrated circuits
MICRON TECHNOLOGY INC0 citations52
US6132798AOct 17, 2000
Method for applying atomized adhesive to a leadframe for chip bonding
MICRON TECHNOLOGY INC1 citations52