Inventor
KANG SUNWON
KR22 patents
⚠️ This page may combine multiple inventors who share the name “KANG SUNWON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
17 patentsUS10861826B2Dec 8, 2020
Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD9 citations84
US11495576B2Nov 8, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US10985138B2Apr 20, 2021
Semiconductor package having a plurality of chips and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US11769746B2Sep 26, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US10211176B2Feb 19, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations71
US8823172B2Sep 2, 2014
Semiconductor package and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US11848255B2Dec 19, 2023
Semiconductor package structure on a PCB and semiconductor module including the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11664348B2May 30, 2023
Substrate assembly semiconductor package including the same and method of manufacturing 1HE semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11257723B2Feb 22, 2022
Inspection system and method for inspecting semiconductor package, and method of fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations61
US10720408B2Jul 21, 2020
High-speed semiconductor modules
SAMSUNG ELECTRONICS CO LTD1 citations61
US12420348B2Sep 23, 2025
Solder reflow apparatus and method of manufacturing electronic device
SAMSUNG ELECTRONICS CO LTD0 citations60
US10943881B2Mar 9, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11018121B2May 25, 2021
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD1 citations54
US12165974B2Dec 10, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US10720382B2Jul 21, 2020
Semiconductor package structure and semiconductor module including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US12009342B2Jun 11, 2024
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations50
US10797030B2Oct 6, 2020
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations44