Inventor
KAYABA MASAO
JP2 patents
Patents
2 patentsUS12392015B2Aug 19, 2025
Printed wiring board, printed circuit board, and electronic component
ISHIKAWA TECH LABORATORY CO LTD0 citations51
US11802322B2Oct 31, 2023
Method for manufacturing solder product, solder, soldered component, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin intermediate product, and conductive member
ISHIKAWA TECH LABORATORY CO LTD0 citations51