Inventor
SHINOHARA KEIJI
JP11 patents
Patents
11 patentsUS5914277AJun 22, 1999
Method for forming metallic wiring pattern
SONY CORP19 citations91
US5207868AMay 4, 1993
Etching process for films of aluminum or its alloys
SONY CORP26 citations91
US5194118AMar 16, 1993
Dry etching method
SONY CORP33 citations91
US5591302AJan 7, 1997
Process for etching copper containing metallic film and for forming copper containing metallic wiring
SONY CORP17 citations82
US5200032AApr 6, 1993
Dry etching method
SONY CORP15 citations81
US5569627AOct 29, 1996
Process for etching copper containing metallic film and for forming copper containing metallic wiring
SONY CORP7 citations73
US5505322AApr 9, 1996
Process for etching copper containing metallic film and forming copper containing metallic wiring
SONY CORP10 citations73
US6355553B1Mar 12, 2002
Method of forming a metal plug in a contact hole
SONY CORP13 citations72
US5502334AMar 26, 1996
Metal wiring
SONY CORP16 citations72
US5312515AMay 17, 1994
Dry etching method
SONY CORP3 citations61
US5288952AFeb 22, 1994
Multilayer connector
SONY CORP1 citations51