Inventor
WELCH MICHAEL
US32 patents
⚠️ This page may combine multiple inventors who share the name “WELCH MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
15 patentsUS6074514AJun 13, 2000
High selectivity etch using an external plasma discharge
APPLIED MATERIALS INC504 citations99
US5843847ADec 1, 1998
Method for etching dielectric layers with high selectivity and low microloading
APPLIED MATERIALS INC319 citations99
US5814563ASep 29, 1998
Method for etching dielectric using fluorohydrocarbon gas, NH3 -generating gas, and carbon-oxygen gas
APPLIED MATERIALS INC110 citations98
US6432259B1Aug 13, 2002
Plasma reactor cooled ceiling with an array of thermally isolated plasma heated mini-gas distribution plates
APPLIED MATERIALS INC104 citations96
US6267549B1Jul 31, 2001
Dual independent robot blades with minimal offset
APPLIED MATERIALS INC66 citations96
US6232236B1May 15, 2001
Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing system
APPLIED MATERIALS INC134 citations96
US6113731ASep 5, 2000
Magnetically-enhanced plasma chamber with non-uniform magnetic field
APPLIED MATERIALS INC152 citations96
US5948168ASep 7, 1999
Distributed microwave plasma reactor for semiconductor processing
APPLIED MATERIALS INC83 citations96
US5780359AJul 14, 1998
Polymer removal from top surfaces and sidewalls of a semiconductor wafer
APPLIED MATERIALS INC67 citations96
US5702530ADec 30, 1997
Distributed microwave plasma reactor for semiconductor processing
APPLIED MATERIALS INC76 citations96
US5740009AApr 14, 1998
Apparatus for improving wafer and chuck edge protection
APPLIED MATERIALS INC117 citations95
US6387288B1May 14, 2002
High selectivity etch using an external plasma discharge
APPLIED MATERIALS INC31 citations92
US5865937AFeb 2, 1999
Broad-band adjustable power ratio phase-inverting plasma reactor
APPLIED MATERIALS INC48 citations92
US6822185B2Nov 23, 2004
Temperature controlled dome-coil system for high power inductively coupled plasma systems
APPLIED MATERIALS INC7 citations73
US6062237AMay 16, 2000
Polymer removal from top surfaces and sidewalls of a semiconductor wafer
APPLIED MATERIALS INC13 citations73
INERTECH IP LLC
5 patentsUS9648784B2May 9, 2017
Systems and assemblies for cooling server racks
INERTECH IP LLC27 citations94
USD744996SDec 8, 2015
Enclosure system for cooling server racks
INERTECH IP LLC22 citations92
US10448539B2Oct 15, 2019
Systems and assemblies for cooling server racks
INERTECH IP LLC8 citations84
US11602074B2Mar 7, 2023
Systems and assemblies for cooling server racks
INERTECH IP LLC3 citations73
USD792389SJul 18, 2017
Enclosure system for server racks
INERTECH IP LLC5 citations73