Inventor
MOROZUMI YUKIO
JP20 patents
⚠️ This page may combine multiple inventors who share the name “MOROZUMI YUKIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEIKO EPSON CORP
17 patentsUS6710460B2Mar 23, 2004
Semiconductor devices and methods for manufacturing the same
SEIKO EPSON CORP59 citations96
US5266525ANov 30, 1993
Microelectronic interlayer dielectric structure and methods of manufacturing same
SEIKO EPSON CORP48 citations96
US6723628B2Apr 20, 2004
Method for forming bonding pad structures in semiconductor devices
SEIKO EPSON CORP18 citations92
US6664644B2Dec 16, 2003
Semiconductor device and method for manufacturing the same
SEIKO EPSON CORP44 citations92
US6194304B1Feb 27, 2001
Semiconductor device and method of fabricating the same
SEIKO EPSON CORP36 citations92
US5514624AMay 7, 1996
Method of manufacturing a microelectronic interlayer dielectric structure
SEIKO EPSON CORP25 citations92
US5051807ASep 24, 1991
Integrated semiconductor structure with incorporated alignment markings
SEIKO EPSON CORP38 citations92
US6246105B1Jun 12, 2001
Semiconductor device and manufacturing process thereof
SEIKO EPSON CORP29 citations86
US6358830B1Mar 19, 2002
Method for manufacturing semiconductor device having interlayer dielectric film layers with like etch speeds
SEIKO EPSON CORP17 citations84
US6137176AOct 24, 2000
Semiconductor device and method of fabricating the same
SEIKO EPSON CORP15 citations82
US7091609B2Aug 15, 2006
Semiconductor devices including an alloy layer and a wetting layer on an interlayer dielectric
SEIKO EPSON CORP5 citations74
US6559545B2May 6, 2003
Semiconductor devices and methods for manufacturing semiconductor devices
SEIKO EPSON CORP7 citations73
US6498090B2Dec 24, 2002
Semiconductor devices and methods for manufacturing the same
SEIKO EPSON CORP10 citations73
US6399477B2Jun 4, 2002
Semiconductor devices and methods for manufacturing semiconductor devices
SEIKO EPSON CORP12 citations73
US5376435ADec 27, 1994
Microelectronic interlayer dielectric structure
SEIKO EPSON CORP10 citations73
US6812123B2Nov 2, 2004
Semiconductor devices and methods for manufacturing the same
SEIKO EPSON CORP3 citations63
US6569785B2May 27, 2003
Semiconductor integrated circuit device having internal tensile and internal compression stress
SEIKO EPSON CORP0 citations52