Inventor

LAI LEI PING

US3 patents

⚠️ This page may combine multiple inventors who share the name “LAI LEI PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOTOROLA INC

2 patents

US5961373AOct 5, 1999

Process for forming a semiconductor device

MOTOROLA INC72 citations94

US5899745AMay 4, 1999

Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor

MOTOROLA INC68 citations94

SAMSUNG AUSTIN SEMICONDUCTOR

1 patent

US6224472B1May 1, 2001

Retaining ring for chemical mechanical polishing

SAMSUNG AUSTIN SEMICONDUCTOR142 citations91