Inventor
CHEN KUO-CHUAN
TW7 patents
⚠️ This page may combine multiple inventors who share the name “CHEN KUO-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
6 patentsUS6277669B1Aug 21, 2001
Wafer level packaging method and packages formed
IND TECH RES INST274 citations98
US6539624B1Apr 1, 2003
Method for forming wafer level package
IND TECH RES INST31 citations92
US6358836B1Mar 19, 2002
Wafer level package incorporating elastomeric pads in dummy plugs
IND TECH RES INST42 citations89
US6444561B1Sep 3, 2002
Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips
IND TECH RES INST16 citations83
US5945774AAug 31, 1999
Open package for crystal oscillator chips
IND TECH RES INST12 citations73
US6137708AOct 24, 2000
Method for forming multi-chip sensing device and device formed
IND TECH RES INST14 citations70