Inventor
ZALESINSKI JERZY MARIA
US10 patents
Patents
10 patentsUS6410431B2Jun 25, 2002
Through-chip conductors for low inductance chip-to-chip integration and off-chip connections
IBM127 citations99
US6236115B1May 22, 2001
High density integrated circuit packaging with chip stacking and via interconnections
IBM342 citations98
US6187678B1Feb 13, 2001
High density integrated circuit packaging with chip stacking and via interconnections
IBM274 citations98
US6002177ADec 14, 1999
High density integrated circuit packaging with chip stacking and via interconnections
IBM408 citations98
US6388198B1May 14, 2002
Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality
IBM95 citations96
US6222276B1Apr 24, 2001
Through-chip conductors for low inductance chip-to-chip integration and off-chip connections
IBM82 citations96
US6943452B2Sep 13, 2005
Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality
IBM47 citations94
US6025992AFeb 15, 2000
Integrated heat exchanger for memory module
IBM139 citations92
US5733466AMar 31, 1998
Electrolytic method of depositing gold connectors on a printed circuit board
IBM79 citations91
US6255208B1Jul 3, 2001
Selective wafer-level testing and burn-in
IBM10 citations72