Inventor
HERKO LAWRENCE H
US8 patents
Patents
8 patentsUS5494698AFeb 27, 1996
Teflon filled resinoid dicing blades for fabricating silicon die modules
XEROX CORP55 citations95
US5408739AApr 25, 1995
Two-step dieing process to form an ink jet face
XEROX CORP49 citations95
US5306370AApr 26, 1994
Method of reducing chipping and contamination of reservoirs and channels in thermal ink printheads during dicing by vacuum impregnation with protective filler material
XEROX CORP32 citations91
US5668061ASep 16, 1997
Method of back cutting silicon wafers during a dicing procedure
XEROX CORP49 citations88
US6436793B1Aug 20, 2002
Methods of forming semiconductor structure
XEROX CORP17 citations80
US5515089AMay 7, 1996
Ink jet printhead with sealed manifold and printhead die
XEROX CORP15 citations73
US5506610AApr 9, 1996
Back side relief on thermal ink jet die assembly
XEROX CORP7 citations73
US5637388AJun 10, 1997
Layered resinoid/diamond blade for precision cutting operations and method of manufacturing same
XEROX CORP10 citations69