Inventor
BOGGS DAVID W
US15 patents
⚠️ This page may combine multiple inventors who share the name “BOGGS DAVID W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
13 patentsUS6580174B2Jun 17, 2003
Vented vias for via in pad technology yield improvements
INTEL CORP84 citations96
US6787443B1Sep 7, 2004
PCB design and method for providing vented blind vias
INTEL CORP139 citations95
US7583513B2Sep 1, 2009
Apparatus for providing an integrated printed circuit board registration coupon
INTEL CORP31 citations92
US6941537B2Sep 6, 2005
Standoff devices and methods of using same
INTEL CORP31 citations91
US7061095B2Jun 13, 2006
Printed circuit board conductor channeling
INTEL CORP27 citations88
US7325303B2Feb 5, 2008
Three-dimensional flexible interposer
INTEL CORP15 citations82
US7201583B2Apr 10, 2007
Three-dimensional flexible interposer
INTEL CORP14 citations82
US7084354B2Aug 1, 2006
PCB method and apparatus for producing landless interconnects
INTEL CORP14 citations82
US7385288B2Jun 10, 2008
Electronic packaging using conductive interproser connector
INTEL CORP5 citations72
US6667090B2Dec 23, 2003
Coupon registration mechanism and method
INTEL CORP7 citations72
US7241680B2Jul 10, 2007
Electronic packaging using conductive interposer connector
INTEL CORP4 citations61
US7147141B2Dec 12, 2006
Preconditioning via plug material for a via-in-pad ball grid array package
INTEL CORP4 citations59
US7061116B2Jun 13, 2006
Arrangement of vias in a substrate to support a ball grid array
INTEL CORP6 citations57