Inventor
DUNGAN JOHN H
US10 patents
Patents
10 patentsUS6580174B2Jun 17, 2003
Vented vias for via in pad technology yield improvements
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US6787443B1Sep 7, 2004
PCB design and method for providing vented blind vias
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US7583513B2Sep 1, 2009
Apparatus for providing an integrated printed circuit board registration coupon
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US6941537B2Sep 6, 2005
Standoff devices and methods of using same
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US7325303B2Feb 5, 2008
Three-dimensional flexible interposer
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US7201583B2Apr 10, 2007
Three-dimensional flexible interposer
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US7084354B2Aug 1, 2006
PCB method and apparatus for producing landless interconnects
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US7385288B2Jun 10, 2008
Electronic packaging using conductive interproser connector
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US6667090B2Dec 23, 2003
Coupon registration mechanism and method
INTEL CORP7 citations72
US7241680B2Jul 10, 2007
Electronic packaging using conductive interposer connector
INTEL CORP4 citations61