Inventor
CHAO KEITH K
US16 patents
⚠️ This page may combine multiple inventors who share the name “CHAO KEITH K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
15 patentsUS6081659AJun 27, 2000
Comparing aerial image to actual photoresist pattern for masking process characterization
LSI LOGIC CORP180 citations99
US6078738AJun 20, 2000
Comparing aerial image to SEM of photoresist or substrate pattern for masking process characterization
LSI LOGIC CORP182 citations99
US5723233AMar 3, 1998
Optical proximity correction method and apparatus
LSI LOGIC CORP323 citations99
US6282696B1Aug 28, 2001
Performing optical proximity correction with the aid of design rule checkers
LSI LOGIC CORP278 citations98
US6269472B1Jul 31, 2001
Optical proximity correction method and apparatus
LSI LOGIC CORP356 citations98
US5804340ASep 8, 1998
Photomask inspection method and inspection tape therefor
LSI LOGIC CORP99 citations98
US5705301AJan 6, 1998
Performing optical proximity correction with the aid of design rule checkers
LSI LOGIC CORP491 citations98
US6499003B2Dec 24, 2002
Method and apparatus for application of proximity correction with unitary segmentation
LSI LOGIC CORP88 citations97
US5900338AMay 4, 1999
Performing optical proximity correction with the aid of design rule checkers
LSI LOGIC CORP86 citations96
US6532585B1Mar 11, 2003
Method and apparatus for application of proximity correction with relative segmentation
LSI LOGIC CORP15 citations92
US6175953B1Jan 16, 2001
Method and apparatus for general systematic application of proximity correction
LSI LOGIC CORP29 citations92
US6157087ADec 5, 2000
Consistent alignment mark profiles on semiconductor wafers using metal organic chemical vapor deposition titanium nitride protective layer
LSI LOGIC CORP22 citations92
US6174630B1Jan 16, 2001
Method of proximity correction with relative segmentation
LSI LOGIC CORP12 citations73
US6060787AMay 9, 2000
Consistent alignment mark profiles on semiconductor wafers using fine grain tungsten protective layer
LSI LOGIC CORP12 citations73
US5981352ANov 9, 1999
Consistent alignment mark profiles on semiconductor wafers using fine grain tungsten protective layer
LSI LOGIC CORP11 citations73