Inventor
CHANG JING-YAO
TW18 patents
⚠️ This page may combine multiple inventors who share the name “CHANG JING-YAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
14 patentsUS7626208B2Dec 1, 2009
Bendable solid state planar light source structure
IND TECH RES INST33 citations91
US8866309B2Oct 21, 2014
Chip package structure
IND TECH RES INST9 citations83
US9706656B2Jul 11, 2017
Signal transmission board and method for manufacturing the same
IND TECH RES INST9 citations82
US10490478B2Nov 26, 2019
Chip packaging and composite system board
IND TECH RES INST2 citations72
US7871836B2Jan 18, 2011
Method of manufacturing bendable solid state lighting
IND TECH RES INST6 citations72
US8742600B2Jun 3, 2014
Dual-phase intermetallic interconnection structure and method of fabricating the same
IND TECH RES INST5 citations71
US10672677B2Jun 2, 2020
Semiconductor package structure
IND TECH RES INST2 citations70
US11756858B2Sep 12, 2023
Power module with housing having bending sections
IND TECH RES INST1 citations62
US11239211B2Feb 1, 2022
Electronic device having a curved portion between a plurality of conductive portions on a substrate
IND TECH RES INST0 citations62
US12500169B2Dec 16, 2025
Embedded packaging structure
IND TECH RES INST0 citations61
US12381133B2Aug 5, 2025
Power semiconductor device
IND TECH RES INST0 citations58
US11114387B2Sep 7, 2021
Electronic packaging structure
IND TECH RES INST0 citations51
US9484315B2Nov 1, 2016
Chip structure having bonding wire
IND TECH RES INST1 citations50
US9240370B1Jan 19, 2016
Power module
IND TECH RES INST1 citations47