Inventor
LIN SU-HORNG
TW24 patents
⚠️ This page may combine multiple inventors who share the name “LIN SU-HORNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
17 patentsUS11414759B2Aug 16, 2022
Mechanisms for supplying process gas into wafer process apparatus
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations85
US10510566B2Dec 17, 2019
Cluster tool techniques with improved efficiency
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations82
US11652007B2May 16, 2023
Metrology method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12400915B2Aug 26, 2025
Metrology method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12359318B2Jul 15, 2025
Mechanisms for supplying process gas into wafer process apparatus
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11854851B2Dec 26, 2023
Interface tool
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11443959B2Sep 13, 2022
Semiconductor manufacturing system and control method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11127629B2Sep 21, 2021
Semiconductor device and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10867812B2Dec 15, 2020
Semiconductor manufacturing system and control method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10460999B2Oct 29, 2019
Metrology device and metrology method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10121653B2Nov 6, 2018
Bottom-up PEALD proces
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10002780B2Jun 19, 2018
Method of manufacturing a semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9633856B2Apr 25, 2017
Method of forming a singe metal that performs N and P work functions in high-K/metal gate devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9184045B2Nov 10, 2015
Bottom-up PEALD process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10755953B2Aug 25, 2020
Cluster tool techniques with improved efficiency
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9543141B2Jan 10, 2017
Method for curing flowable layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations43
US9435048B2Sep 6, 2016
Layer by layer electro chemical plating (ECP) process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41
TAIWAN SEMICONDUCTOR MFG
5 patentsUS7193325B2Mar 20, 2007
Reliability improvement of SiOC etch with trimethylsilane gas passivation in Cu damascene interconnects
TAIWAN SEMICONDUCTOR MFG19 citations91
US7138337B2Nov 21, 2006
Methods of forming tungsten contacts by chemical vapor deposition
TAIWAN SEMICONDUCTOR MFG8 citations73
US9331168B2May 3, 2016
Semiconductor structure and manufacuturing method of the same
TAIWAN SEMICONDUCTOR MFG2 citations61
US8932921B2Jan 13, 2015
N/P metal crystal orientation for high-k metal gate Vt modulation
TAIWAN SEMICONDUCTOR MFG0 citations52
US9070681B2Jun 30, 2015
Method of forming a single metal that performs N and P work functions in high-K/metal gate devices
TAIWAN SEMICONDUCTOR MFG1 citations51