P

Inventor

LIN SU-HORNG

TW24 patents
⚠️ This page may combine multiple inventors who share the name “LIN SU-HORNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

17 patents
US11414759B2Aug 16, 2022

Mechanisms for supplying process gas into wafer process apparatus

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations85
US10510566B2Dec 17, 2019

Cluster tool techniques with improved efficiency

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations82
US11652007B2May 16, 2023

Metrology method

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12400915B2Aug 26, 2025

Metrology method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12359318B2Jul 15, 2025

Mechanisms for supplying process gas into wafer process apparatus

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11854851B2Dec 26, 2023

Interface tool

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11443959B2Sep 13, 2022

Semiconductor manufacturing system and control method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11127629B2Sep 21, 2021

Semiconductor device and fabricating method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10867812B2Dec 15, 2020

Semiconductor manufacturing system and control method

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10460999B2Oct 29, 2019

Metrology device and metrology method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10121653B2Nov 6, 2018

Bottom-up PEALD proces

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10002780B2Jun 19, 2018

Method of manufacturing a semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9633856B2Apr 25, 2017

Method of forming a singe metal that performs N and P work functions in high-K/metal gate devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9184045B2Nov 10, 2015

Bottom-up PEALD process

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10755953B2Aug 25, 2020

Cluster tool techniques with improved efficiency

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9543141B2Jan 10, 2017

Method for curing flowable layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations43
US9435048B2Sep 6, 2016

Layer by layer electro chemical plating (ECP) process

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41

TAIWAN SEMICONDUCTOR MFG

5 patents

LIN SU-HORNG

2 patents