Inventor
CHU KUNMO
KR6 patents
Patents
6 patentsUS10392518B2Aug 27, 2019
Paste material, wiring member formed from the paste material, and electronic device including the wiring member
SAMSUNG ELECTRONICS CO LTD3 citations71
US10249604B2Apr 2, 2019
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations69
US9831211B2Nov 28, 2017
Anisotropic conductive material, electronic device including anisotropic conductive material, and method of manufacturing electronic device
SAMSUNG ELECTRONICS CO LTD5 citations66
US12370632B2Jul 29, 2025
Metal particle for adhesive paste, method of preparing the same, solder paste including the same, composite bonding structure formed therefrom, and semiconductor device including the composite bonding structure
SAMSUNG ELECTRONICS CO LTD0 citations60
US12288765B2Apr 29, 2025
Hybrid bonding structures, semiconductor devices having the same, and methods of manufacturing the semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations60
US11804462B2Oct 31, 2023
Hybrid bonding structures and semiconductor devices including the same
SAMSUNG ELECTRONICS CO LTD0 citations60