P

Inventor

MEYER HEINRICH

DE41 patents
⚠️ This page may combine multiple inventors who share the name “MEYER HEINRICH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ATOTECH DEUTSCHLAND GMBH

20 patents
US6409072B1Jun 25, 2002

Chemical microreactors and method for producing same

ATOTECH DEUTSCHLAND GMBH129 citations97
US6099711AAug 8, 2000

Process for the electrolytic deposition of metal layers

ATOTECH DEUTSCHLAND GMBH125 citations96
US6865081B2Mar 8, 2005

Microstructure cooler and use thereof

ATOTECH DEUTSCHLAND GMBH71 citations92
US6793795B1Sep 21, 2004

Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits

ATOTECH DEUTSCHLAND GMBH23 citations92
US6403168B2Jun 11, 2002

Process for plating metal coatings

ATOTECH DEUTSCHLAND GMBH19 citations92
US6221440B1Apr 24, 2001

Process for plating metal coating

ATOTECH DEUTSCHLAND GMBH36 citations92
US6562149B1May 13, 2003

Solution and process to pretreat copper surfaces

ATOTECH DEUTSCHLAND GMBH31 citations91
US5693209ADec 2, 1997

Process for metallization of a nonconductor surface

ATOTECH DEUTSCHLAND GMBH27 citations90
US6451498B1Sep 17, 2002

Photosensitive composition

ATOTECH DEUTSCHLAND GMBH24 citations89
US5916485AJun 29, 1999

Method of manufacturing highly conducting composites containing only small proportions of electron conductors

ATOTECH DEUTSCHLAND GMBH28 citations89
US6235182B1May 22, 2001

Solution for pretreatment of electrically non-conductive surfaces, and method of coating the surfaces with solid material particles

ATOTECH DEUTSCHLAND GMBH20 citations87
US5597471AJan 28, 1997

Solution for coating non-conductors with conductive polymers and their metallization process

ATOTECH DEUTSCHLAND GMBH23 citations84
US5705219AJan 6, 1998

Method for coating surfaces with finely particulate materials

ATOTECH DEUTSCHLAND GMBH18 citations80
US6706201B1Mar 16, 2004

Method for producing metallized substrate materials

ATOTECH DEUTSCHLAND GMBH14 citations79
US7380698B2Jun 3, 2008

Method of connecting module layers suitable for the production of microstructure modules and a microstructure module

ATOTECH DEUTSCHLAND GMBH14 citations77
US6736983B1May 18, 2004

Method for producing microcomponents

ATOTECH DEUTSCHLAND GMBH12 citations71
US6723385B1Apr 20, 2004

Process for the preliminary treatment of copper surfaces

ATOTECH DEUTSCHLAND GMBH10 citations71
US6240934B1Jun 5, 2001

Method and device for treating holes or recesses extending into workpieces with liquid treatment media

ATOTECH DEUTSCHLAND GMBH7 citations67
US6593249B2Jul 15, 2003

Method for forming a metal pattern on a dielectric substrate

ATOTECH DEUTSCHLAND GMBH5 citations61
US7138043B2Nov 21, 2006

Method for applying a metal layer to a light metal surface

ATOTECH DEUTSCHLAND GMBH5 citations54

SIEMENS AG

4 patents

BOGE GMBH

4 patents

SCHERING AG

2 patents

MANNESMANN BOGE GMBH

2 patents

BOGE AG

1 patent

FRAUNHOFER GES FORSCHUNG

1 patent

HERAEUS GMBH W C

1 patent

ATOTCH DEUTSCHLAND GMBH

1 patent

ATOTECH DEUTSCHALND GMBH

1 patent

HEINZE DYCONEX PATENTE

1 patent

ATOTECH DUETSCHLAND GMBH

1 patent

ZAHNRADFABRIK FRIEDRICHSHAFEN

1 patent

MEYER HEINRICH

1 patent