Inventor
MEYER HEINRICH
DE41 patents
⚠️ This page may combine multiple inventors who share the name “MEYER HEINRICH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ATOTECH DEUTSCHLAND GMBH
20 patentsUS6409072B1Jun 25, 2002
Chemical microreactors and method for producing same
ATOTECH DEUTSCHLAND GMBH129 citations97
US6099711AAug 8, 2000
Process for the electrolytic deposition of metal layers
ATOTECH DEUTSCHLAND GMBH125 citations96
US6865081B2Mar 8, 2005
Microstructure cooler and use thereof
ATOTECH DEUTSCHLAND GMBH71 citations92
US6793795B1Sep 21, 2004
Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
ATOTECH DEUTSCHLAND GMBH23 citations92
US6403168B2Jun 11, 2002
Process for plating metal coatings
ATOTECH DEUTSCHLAND GMBH19 citations92
US6221440B1Apr 24, 2001
Process for plating metal coating
ATOTECH DEUTSCHLAND GMBH36 citations92
US6562149B1May 13, 2003
Solution and process to pretreat copper surfaces
ATOTECH DEUTSCHLAND GMBH31 citations91
US5693209ADec 2, 1997
Process for metallization of a nonconductor surface
ATOTECH DEUTSCHLAND GMBH27 citations90
US6451498B1Sep 17, 2002
Photosensitive composition
ATOTECH DEUTSCHLAND GMBH24 citations89
US5916485AJun 29, 1999
Method of manufacturing highly conducting composites containing only small proportions of electron conductors
ATOTECH DEUTSCHLAND GMBH28 citations89
US6235182B1May 22, 2001
Solution for pretreatment of electrically non-conductive surfaces, and method of coating the surfaces with solid material particles
ATOTECH DEUTSCHLAND GMBH20 citations87
US5597471AJan 28, 1997
Solution for coating non-conductors with conductive polymers and their metallization process
ATOTECH DEUTSCHLAND GMBH23 citations84
US5705219AJan 6, 1998
Method for coating surfaces with finely particulate materials
ATOTECH DEUTSCHLAND GMBH18 citations80
US6706201B1Mar 16, 2004
Method for producing metallized substrate materials
ATOTECH DEUTSCHLAND GMBH14 citations79
US7380698B2Jun 3, 2008
Method of connecting module layers suitable for the production of microstructure modules and a microstructure module
ATOTECH DEUTSCHLAND GMBH14 citations77
US6736983B1May 18, 2004
Method for producing microcomponents
ATOTECH DEUTSCHLAND GMBH12 citations71
US6723385B1Apr 20, 2004
Process for the preliminary treatment of copper surfaces
ATOTECH DEUTSCHLAND GMBH10 citations71
US6240934B1Jun 5, 2001
Method and device for treating holes or recesses extending into workpieces with liquid treatment media
ATOTECH DEUTSCHLAND GMBH7 citations67
US6593249B2Jul 15, 2003
Method for forming a metal pattern on a dielectric substrate
ATOTECH DEUTSCHLAND GMBH5 citations61
US7138043B2Nov 21, 2006
Method for applying a metal layer to a light metal surface
ATOTECH DEUTSCHLAND GMBH5 citations54
SIEMENS AG
4 patentsUS7119687B2Oct 10, 2006
System for tracking object locations using self-tracking tags
SIEMENS AG63 citations94
US10192080B2Jan 29, 2019
Method for configuring a communication module of at least one radio-frequency identification (RFID) reader and communication module
SIEMENS AG0 citations42
US5487076AJan 23, 1996
Method for securing data in read-write memories in mobile data storage systems
SIEMENS AG0 citations42
US10802132B2Oct 13, 2020
Position-sensing sensor and position-sensing system
SIEMENS AG0 citations40
BOGE GMBH
4 patentsUS4781362ANov 1, 1988
Hydraulically damping elastic bearing
BOGE GMBH30 citations92
US5954317ASep 21, 1999
Hydraulically damping rubber bearing
BOGE GMBH37 citations89
US5895031AApr 20, 1999
Hydraulically damping engine mounting
BOGE GMBH10 citations74
US4697794AOct 6, 1987
Rubber mounting with hydraulic damping
BOGE GMBH9 citations73