Inventor
CHEN YING-LIN
TW14 patents
⚠️ This page may combine multiple inventors who share the name “CHEN YING-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
4 patentsUS6448167B1Sep 10, 2002
Process flow to reduce spacer undercut phenomena
TAIWAN SEMICONDUCTOR MFG41 citations92
US7829815B2Nov 9, 2010
Adjustable electrodes and coils for plasma density distribution control
TAIWAN SEMICONDUCTOR MFG25 citations91
US6610571B1Aug 26, 2003
Approach to prevent spacer undercut by low temperature nitridation
TAIWAN SEMICONDUCTOR MFG18 citations89
US6916718B2Jul 12, 2005
Approach to prevent undercut of oxide layer below gate spacer through nitridation
TAIWAN SEMICONDUCTOR MFG6 citations71
POWERTECH TECHNOLOGY INC
3 patentsUS9627228B1Apr 18, 2017
Method for manufacturing a chip package having a coating layer
POWERTECH TECHNOLOGY INC11 citations76
US11410945B2Aug 9, 2022
Semiconductor package having partial outer metal layer and packaging method thereof
POWERTECH TECHNOLOGY INC0 citations56
US11587808B2Feb 21, 2023
Chip carrier device
POWERTECH TECHNOLOGY INC0 citations45
IBM
2 patentsHON HAI PREC IND CO LTD
2 patentsTRIPLE WIN TECH SHENZHEN CO LTD
2 patentsUS12206809B2Jan 21, 2025
Lens module easily disassembled from terminal device and terminal device
TRIPLE WIN TECH SHENZHEN CO LTD0 citations50
US12225660B2Feb 11, 2025
Circuit board assembly for blocking unwanted light, camera module, and electronic device having the same
TRIPLE WIN TECH SHENZHEN CO LTD0 citations38