Inventor
CHIEN YUH-HARNG
TW20 patents
Patents
20 patentsUS10121733B2Nov 6, 2018
Wire support for a leadframe
TEXAS INSTRUMENTS INC4 citations83
US9627331B1Apr 18, 2017
Method of making a wire support leadframe for a semiconductor device
TEXAS INSTRUMENTS INC6 citations83
US10573581B2Feb 25, 2020
Leadframe
TEXAS INSTRUMENTS INC1 citations61
US12040197B2Jul 16, 2024
Mechanical couplings designed to resolve process constraints
TEXAS INSTRUMENTS INC0 citations60
US10957631B2Mar 23, 2021
Angled die pad of a leadframe for a molded integrated circuit package
TEXAS INSTRUMENTS INC0 citations60
US11942448B2Mar 26, 2024
Integrated circuit die pad cavity
TEXAS INSTRUMENTS INC0 citations59
US12532752B2Jan 20, 2026
Packages with multiple exposed pads
TEXAS INSTRUMENTS INC0 citations58
US11735506B2Aug 22, 2023
Packages with multiple exposed pads
TEXAS INSTRUMENTS INC0 citations58
US11081428B2Aug 3, 2021
Electronic device with three dimensional thermal pad
TEXAS INSTRUMENTS INC0 citations58
US11862538B2Jan 2, 2024
Semiconductor die mounted in a recess of die pad
TEXAS INSTRUMENTS INC0 citations56
US11742265B2Aug 29, 2023
Exposed heat-generating devices
TEXAS INSTRUMENTS INC0 citations56
US10811343B2Oct 20, 2020
Method of making a wire support leadframe for a semiconductor device
TEXAS INSTRUMENTS INC0 citations51
US10529654B2Jan 7, 2020
Wire support for a leadframe
TEXAS INSTRUMENTS INC0 citations51
US10229868B2Mar 12, 2019
Method of making a wire support leadframe for a semiconductor device
TEXAS INSTRUMENTS INC0 citations51
US11444012B2Sep 13, 2022
Packaged electronic device with split die pad in robust package substrate
TEXAS INSTRUMENTS INC0 citations50
US11817374B2Nov 14, 2023
Electronic device with exposed tie bar
TEXAS INSTRUMENTS INC0 citations49
US10340152B1Jul 2, 2019
Mechanical couplings designed to resolve process constraints
TEXAS INSTRUMENTS INC0 citations49
US11538740B2Dec 27, 2022
Leads for semiconductor package
TEXAS INSTRUMENTS INC0 citations47
US11081429B2Aug 3, 2021
Finger pad leadframe
TEXAS INSTRUMENTS INC0 citations47
US10861777B2Dec 8, 2020
Wire bond clamp design and lead frame capable of engaging with same
TEXAS INSTRUMENTS INC0 citations38