Inventor
JUNG WOON KAB
KR7 patents
⚠️ This page may combine multiple inventors who share the name “JUNG WOON KAB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
4 patentsUS10347562B1Jul 9, 2019
Methods and structures for increasing the allowable die size in TMV packages
AMKOR TECHNOLOGY INC7 citations83
US10714408B2Jul 14, 2020
Semiconductor devices and methods of making semiconductor devices
AMKOR TECHNOLOGY INC1 citations72
US10090230B2Oct 2, 2018
Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
AMKOR TECHNOLOGY INC2 citations72
US11430723B2Aug 30, 2022
Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
AMKOR TECHNOLOGY INC0 citations61
AMKOR TECH SINGAPORE HOLDING PTE LTD
2 patentsUS11488892B2Nov 1, 2022
Methods and structures for increasing the allowable die size in TMV packages
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US12107035B2Oct 1, 2024
Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61