Inventor
CHO BYONG WOO
KR9 patents
⚠️ This page may combine multiple inventors who share the name “CHO BYONG WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
4 patentsUS10090230B2Oct 2, 2018
Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
AMKOR TECHNOLOGY INC2 citations72
US9917063B2Mar 13, 2018
Semiconductor package structure for improving die warpage and manufacturing method thereof
AMKOR TECHNOLOGY INC4 citations70
US11430723B2Aug 30, 2022
Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
AMKOR TECHNOLOGY INC0 citations61
US10504857B2Dec 10, 2019
Semiconductor package structure for improving die warpage and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations49
AMKOR TECH SINGAPORE HOLDING PTE LTD
4 patentsUS11031356B2Jun 8, 2021
Semiconductor package structure for improving die warpage and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations70
US12288764B2Apr 29, 2025
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US12107035B2Oct 1, 2024
Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US11049828B2Jun 29, 2021
Electronic device with interconnection structure oblate ellipsoid-shaped aperture
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61