P

Inventor

HIROSE NAOHIRO

JP63 patents
⚠️ This page may combine multiple inventors who share the name “HIROSE NAOHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBIDEN CO LTD

21 patents
US6591495B2Jul 15, 2003

Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating

IBIDEN CO LTD102 citations98
US7691189B2Apr 6, 2010

Printed wiring board and its manufacturing method

IBIDEN CO LTD57 citations97
US7230188B1Jun 12, 2007

Printed wiring board and its manufacturing method

IBIDEN CO LTD55 citations96
US6609297B1Aug 26, 2003

Method of manufacturing multilayer printed wiring board

IBIDEN CO LTD59 citations96
US6407345B1Jun 18, 2002

Printed circuit board and method of production thereof

IBIDEN CO LTD48 citations96
US7415761B2Aug 26, 2008

Method of manufacturing multilayered circuit board

IBIDEN CO LTD35 citations95
US6613986B1Sep 2, 2003

Multilayer build-up wiring board

IBIDEN CO LTD42 citations95
US7332816B2Feb 19, 2008

Method of fabricating crossing wiring pattern on a printed circuit board

IBIDEN CO LTD19 citations93
US7127812B2Oct 31, 2006

Process for producing a multi-layer printed wiring board

IBIDEN CO LTD15 citations93
US7827680B2Nov 9, 2010

Electroplating process of electroplating an elecrically conductive sustrate

IBIDEN CO LTD11 citations84
US7525190B2Apr 28, 2009

Printed wiring board with wiring pattern having narrow width portion

IBIDEN CO LTD10 citations84
US7418174B2Aug 26, 2008

Optical transmission structural body, optical waveguide, optical waveguide formation method, and optical wiring connection body

IBIDEN CO LTD9 citations84
US8035214B1Oct 11, 2011

Conductive connecting pin for package substance

IBIDEN CO LTD8 citations83
US7902659B2Mar 8, 2011

Conductive connecting pin and package substrate

IBIDEN CO LTD8 citations83
US7832098B2Nov 16, 2010

Method of manufacturing a multilayered printed circuit board

IBIDEN CO LTD10 citations83
US7514779B2Apr 7, 2009

Multilayer build-up wiring board

IBIDEN CO LTD8 citations83
US7375289B2May 20, 2008

Multi-layer printed wiring board including an alignment mark as an index for a position of via holes

IBIDEN CO LTD6 citations74
US7847318B2Dec 7, 2010

Multilayer build-up wiring board including a chip mount region

IBIDEN CO LTD6 citations73
US8018046B2Sep 13, 2011

Printed wiring board with notched conductive traces

IBIDEN CO LTD3 citations63
US7933480B2Apr 26, 2011

Optical transmission structural body, optical waveguide, optical waveguide formation method, and optical wiring connection body

IBIDEN CO LTD2 citations63
US7574085B2Aug 11, 2009

Optical transmission structural body, optical waveguide, optical waveguide formation method, and optical wiring connection body

IBIDEN CO LTD3 citations63

KONISHIROKU PHOTO IND

12 patents

HIROSE NAOHIRO

8 patents

KONICA MINOLTA BUSINESS TECH

4 patents

KONICA MINOLTA HOLDINGS INC

2 patents

MITSUBISHI ELECTRIC CORP

1 patent

EN HONCHIN

1 patent

KONOSHIROKU PHOTO INDUSTRY CO

1 patent

Showing the top 50 of 63 patents by PatentIndex Score.