Inventor

LIEW SOON LEE

MY5 patents

⚠️ This page may combine multiple inventors who share the name “LIEW SOON LEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MACOM TECH SOLUTIONS HOLDINGS INC

2 patents

US12451413B2Oct 21, 2025

Packaged semiconductor devices with leadframes having tie bar with recessed cavity

MACOM TECH SOLUTIONS HOLDINGS INC0 citations58

US12009286B2Jun 11, 2024

Methods of forming packaged semiconductor devices and leadframes for semiconductor device packages

MACOM TECH SOLUTIONS HOLDINGS INC0 citations58

WOLFSPEED INC

2 patents

US12470185B2Nov 11, 2025

Semiconductor device packages with exposed heat dissipating surfaces and methods of fabricating the same

WOLFSPEED INC0 citations56

US12119239B2Oct 15, 2024

Packaged semiconductor devices, and package molds for forming packaged semiconductor devices

WOLFSPEED INC0 citations54

INFINEON TECHNOLOGIES AG

1 patent

US10777536B2Sep 15, 2020

Semiconductor package with air cavity

INFINEON TECHNOLOGIES AG2 citations64