Inventor
KOVAC CAROLINE A
US15 patents
⚠️ This page may combine multiple inventors who share the name “KOVAC CAROLINE A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
14 patentsUS4574095AMar 4, 1986
Selective deposition of copper
IBM144 citations98
US4832255AMay 23, 1989
Precision solder transfer method and means
IBM34 citations92
US5242713ASep 7, 1993
Method for conditioning an organic polymeric material
IBM28 citations91
US5203955AApr 20, 1993
Method for etching an organic polymeric material
IBM28 citations90
US4869930ASep 26, 1989
Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization
IBM36 citations90
US4881885ANov 21, 1989
Dam for lead encapsulation
IBM19 citations81
US5135779AAug 4, 1992
Method for conditioning an organic polymeric material
IBM11 citations74
US5462628AOct 31, 1995
Method for bonding two surfaces together
IBM12 citations73
US5130781AJul 14, 1992
Dam for lead encapsulation
IBM15 citations73
US5047834ASep 10, 1991
High strength low stress encapsulation of interconnected semiconductor devices
IBM7 citations73
US5503698AApr 2, 1996
Bonding method employing organometallic interconnectors
IBM5 citations72
US5178914AJan 12, 1993
Means of seeding and metallizing polymide
IBM17 citations71
US5132351AJul 21, 1992
Chemical solder comprising a metal salt, polyphthalaldehyde and a solvent
IBM3 citations61
US4780754AOct 25, 1988
Polysiloxane modified cement
IBM3 citations61