Inventor
FOGAL RICH
US68 patents
⚠️ This page may combine multiple inventors who share the name “FOGAL RICH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
47 patentsUS6051886AApr 18, 2000
Angularly offset stacked die multichip device and method of manufacture
MICRON TECHNOLOGY INC222 citations99
US5721452AFeb 24, 1998
Angularly offset stacked die multichip device and method of manufacture
MICRON TECHNOLOGY INC150 citations99
US5140404AAug 18, 1992
Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
MICRON TECHNOLOGY INC208 citations99
US7227095B2Jun 5, 2007
Wire bonders and methods of wire-bonding
MICRON TECHNOLOGY INC137 citations98
US6563205B1May 13, 2003
Angularly offset and recessed stacked die multichip device and method of manufacture
MICRON TECHNOLOGY INC115 citations98
US5963794AOct 5, 1999
Angularly offset stacked die multichip device and method of manufacture
MICRON TECHNOLOGY INC102 citations98
US5886412AMar 23, 1999
Angularly offset and recessed stacked die multichip device
MICRON TECHNOLOGY INC113 citations98
US5874781AFeb 23, 1999
Angularly offset stacked die multichip device and method of manufacture
MICRON TECHNOLOGY INC114 citations98
US7977597B2Jul 12, 2011
Wire bonders and methods of wire-bonding
MICRON TECHNOLOGY INC107 citations97
US5647528AJul 15, 1997
Bondhead lead clamp apparatus and method
MICRON TECHNOLOGY INC60 citations97
US6068174AMay 30, 2000
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
MICRON TECHNOLOGY INC56 citations96
US6000599ADec 14, 1999
Bondhead lead clamp apparatus and method
MICRON TECHNOLOGY INC34 citations96
US5954842ASep 21, 1999
Lead finger clamp assembly
MICRON TECHNOLOGY INC60 citations96
US5177032AJan 5, 1993
Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
MICRON TECHNOLOGY INC105 citations96
US6537400B1Mar 25, 2003
Automated method of attaching flip chip devices to a substrate
MICRON TECHNOLOGY INC20 citations93
US6334566B1Jan 1, 2002
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
MICRON TECHNOLOGY INC15 citations93
US6196445B1Mar 6, 2001
Method for positioning the bond head in a wire bonding machine
MICRON TECHNOLOGY INC16 citations93
US6047468AApr 11, 2000
Lead finger clamp assembly and method of stabilizing lead frame elements
MICRON TECHNOLOGY INC31 citations93
US5905305AMay 18, 1999
Condensed memory matrix
MICRON TECHNOLOGY INC20 citations93
US5813590ASep 29, 1998
Extended travel wire bonding machine
MICRON TECHNOLOGY INC19 citations93
US5662261ASep 2, 1997
Wire bonding capillary
MICRON TECHNOLOGY INC43 citations93
US5559366ASep 24, 1996
Lead finger tread for a semiconductor lead package system
MICRON TECHNOLOGY INC35 citations93
US6117693ASep 12, 2000
System for fabricating and testing assemblies containing wire bonded semiconductor dice
MICRON TECHNOLOGY INC18 citations89
US5918107AJun 29, 1999
Method and system for fabricating and testing assemblies containing wire bonded semiconductor dice
MICRON TECHNOLOGY INC31 citations89
US5758942AJun 2, 1998
Mechanical vision system using selective wavelength and brightness illumination
MICRON TECHNOLOGY INC47 citations89
US9595513B2Mar 14, 2017
Proximity coupling of interconnect packaging systems and methods
MICRON TECHNOLOGY INC11 citations84
US8354301B2Jan 15, 2013
Packaged microdevices and methods for manufacturing packaged microdevices
MICRON TECHNOLOGY INC7 citations84
US7868440B2Jan 11, 2011
Packaged microdevices and methods for manufacturing packaged microdevices
MICRON TECHNOLOGY INC11 citations84
US6884657B1Apr 26, 2005
Angularly offset stacked die multichip device and method of manufacture
MICRON TECHNOLOGY INC14 citations84
US6478211B2Nov 12, 2002
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
MICRON TECHNOLOGY INC13 citations82
US6464123B2Oct 15, 2002
Bondhead lead clamp apparatus and method
MICRON TECHNOLOGY INC9 citations82
US6435400B1Aug 20, 2002
Bondhead lead clamp apparatus and method
MICRON TECHNOLOGY INC9 citations82
US6325275B1Dec 4, 2001
Bondhead lead clamp apparatus and method
MICRON TECHNOLOGY INC11 citations82
US6299049B1Oct 9, 2001
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
MICRON TECHNOLOGY INC9 citations82
US6290116B1Sep 18, 2001
Bondhead lead clamp apparatus and method
MICRON TECHNOLOGY INC13 citations82
US6015079AJan 18, 2000
Positioning device for controlling the position of a workpiece in a horizontal plane
MICRON TECHNOLOGY INC8 citations82
US5971256AOct 26, 1999
Quick change precisor
MICRON TECHNOLOGY INC12 citations82
US6991970B2Jan 31, 2006
Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of semiconductor device
MICRON TECHNOLOGY INC14 citations79
US6845898B2Jan 25, 2005
Bondhead lead clamp apparatus
MICRON TECHNOLOGY INC4 citations74
US6793749B2Sep 21, 2004
Automated method of attaching flip-chip devices to a substrate
MICRON TECHNOLOGY INC11 citations74
US6773523B2Aug 10, 2004
Automated method of attaching flip chip devices to a substrate
MICRON TECHNOLOGY INC5 citations74
US6662993B2Dec 16, 2003
Bondhead lead clamp apparatus
MICRON TECHNOLOGY INC3 citations74
US6604671B2Aug 12, 2003
Bondhead lead clamp apparatus and method
MICRON TECHNOLOGY INC5 citations74
US6390350B2May 21, 2002
Quick change precisor
MICRON TECHNOLOGY INC6 citations74
US6237830B1May 29, 2001
Quick change precisor
MICRON TECHNOLOGY INC6 citations74
US6133630AOct 17, 2000
Condensed memory matrix
MICRON TECHNOLOGY INC9 citations74
US6071757AJun 6, 2000
Condensed memory matrix
MICRON TECHNOLOGY INC9 citations74
MICRON SEMICONDUCTOR INC
3 patentsUS5323060AJun 21, 1994
Multichip module having a stacked chip arrangement
MICRON SEMICONDUCTOR INC590 citations99
US5322207AJun 21, 1994
Method and apparatus for wire bonding semiconductor dice to a leadframe
MICRON SEMICONDUCTOR INC141 citations97
US5350106ASep 27, 1994
Semiconductor wire bonding method
MICRON SEMICONDUCTOR INC18 citations82
Showing the top 50 of 68 patents by PatentIndex Score.