P

Inventor

WENZEL ROBERT J

US27 patents
⚠️ This page may combine multiple inventors who share the name “WENZEL ROBERT J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FREESCALE SEMICONDUCTOR INC

14 patents
US6921975B2Jul 26, 2005

Circuit device with at least partial packaging, exposed active surface and a voltage reference plane

FREESCALE SEMICONDUCTOR INC233 citations98
US6838776B2Jan 4, 2005

Circuit device with at least partial packaging and method for forming

FREESCALE SEMICONDUCTOR INC314 citations98
US6812580B1Nov 2, 2004

Semiconductor package having optimized wire bond positioning

FREESCALE SEMICONDUCTOR INC117 citations98
US7405102B2Jul 29, 2008

Methods and apparatus for thermal management in a multi-layer embedded chip structure

FREESCALE SEMICONDUCTOR INC69 citations97
US7361987B2Apr 22, 2008

Circuit device with at least partial packaging and method for forming

FREESCALE SEMICONDUCTOR INC75 citations97
US7892882B2Feb 22, 2011

Methods and apparatus for a semiconductor device package with improved thermal performance

FREESCALE SEMICONDUCTOR INC26 citations92
US7763976B2Jul 27, 2010

Integrated circuit module with integrated passive device

FREESCALE SEMICONDUCTOR INC38 citations92
US7632715B2Dec 15, 2009

Method of packaging semiconductor devices

FREESCALE SEMICONDUCTOR INC44 citations92
US7528069B2May 5, 2009

Fine pitch interconnect and method of making

FREESCALE SEMICONDUCTOR INC7 citations74
US7674656B2Mar 9, 2010

Die positioning for packaged integrated circuits

FREESCALE SEMICONDUCTOR INC2 citations56
US9748168B2Aug 29, 2017

Substrate with routing

FREESCALE SEMICONDUCTOR INC0 citations42
US7579219B2Aug 25, 2009

Semiconductor device with a protected active die region and method therefor

FREESCALE SEMICONDUCTOR INC0 citations42
US7553753B2Jun 30, 2009

Method of forming crack arrest features in embedded device build-up package and package thereof

FREESCALE SEMICONDUCTOR INC0 citations41
US7834466B2Nov 16, 2010

Semiconductor die with die pad pattern

FREESCALE SEMICONDUCTOR INC0 citations31

FRYMASTER CORP

3 patents

BARTLEY MACHINES & MANUFACTURI

2 patents

BURGER KING CORP

2 patents

ALCO STANDARD CORP

1 patent

BARTLEY MACHINES & MFG

1 patent

GARLAND COMMERCIAL IND INC

1 patent

LINCOLN FOODSERVICE

1 patent

LEAL GEORGE R

1 patent

WENZEL ROBERT J

1 patent