Inventor

HARPER PETER R

US24 patents

⚠️ This page may combine multiple inventors who share the name “HARPER PETER R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HARPER PETER R

FREESCALE SEMICONDUCTOR INC

Semiconductor package having optimized wire bond positioning

Inductive device including bond wires

Semiconductor device having a bond pad and method therefor

Packaged IC using insulated wire

Integrated circuit with test pad structure and method of testing

Semiconductor device having a bond pad and method therefor

Semiconductor device having a bond pad and method therefor

Packaged integrated circuit having wire bonds and method therefor

MAXIM INTEGRATED PRODUCTS

Wafer-level passive device integration

Multichip wafer level package (WLP) optical device

Semiconductor device having a buffer material and stiffener

Multi-die, high current wafer level package

Multi-die, high current wafer level package

Wafer level device and method with cantilever pillar structure

Enhanced board level reliability for wafer level packages

TEXAS INSTRUMENTS INC

Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom

Semiconductor device having wafer level chip scale packaging substrate decoupling

Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom

BGA package with traces for plating pads under the chip

Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad

APPLE INC

Wafer level optical module

Wafer level optical module

RHYNER KENNETH ROBERT

Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad

HARPER PETER R

Semiconductor package device having passive energy components