Inventor
ANTHONY BRIAN G
US5 patents
Patents
5 patentsUS6713381B2Mar 30, 2004
Method of forming semiconductor device including interconnect barrier layers
MOTOROLA INC135 citations95
US6444569B2Sep 3, 2002
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
MOTOROLA INC60 citations95
US6274478B1Aug 14, 2001
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
MOTOROLA INC70 citations95
US6573173B2Jun 3, 2003
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
MOTOROLA INC23 citations91
US6451181B1Sep 17, 2002
Method of forming a semiconductor device barrier layer
MOTOROLA INC36 citations87