P

Inventor

AHMAD SYED S

US22 patents
⚠️ This page may combine multiple inventors who share the name “AHMAD SYED S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

20 patents
US6017776AJan 25, 2000

Method of attaching a leadframe to singulated semiconductor dice

MICRON TECHNOLOGY INC62 citations96
US5616953AApr 1, 1997

Lead frame surface finish enhancement

MICRON TECHNOLOGY INC88 citations96
US6083768AJul 4, 2000

Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components

MICRON TECHNOLOGY INC19 citations92
US6013535AJan 11, 2000

Method for applying adhesives to a lead frame

MICRON TECHNOLOGY INC30 citations92
US7928579B2Apr 19, 2011

Devices including sloped vias in a substrate and devices including spring-like deflecting contacts

MICRON TECHNOLOGY INC14 citations84
US6200833B1Mar 13, 2001

Method of attaching a leadframe to singulated semiconductor dice

MICRON TECHNOLOGY INC14 citations82
US6979598B2Dec 27, 2005

Method of attaching a leadframe to singulated semiconductor dice

MICRON TECHNOLOGY INC5 citations74
US6706559B2Mar 16, 2004

Method of attaching a leadframe to singulated semiconductor dice

MICRON TECHNOLOGY INC4 citations74
US6506628B2Jan 14, 2003

Method of attaching a leadframe to singulated semiconductor dice

MICRON TECHNOLOGY INC7 citations74
US6346152B1Feb 12, 2002

Method and apparatus for applying adhesives to a lead frame

MICRON TECHNOLOGY INC10 citations74
US7390740B2Jun 24, 2008

Sloped vias in a substrate, spring-like contacts, and methods of making

MICRON TECHNOLOGY INC4 citations63
US6890384B2May 10, 2005

Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid

MICRON TECHNOLOGY INC2 citations63
US6818460B2Nov 16, 2004

Method for applying adhesives to a lead frame

MICRON TECHNOLOGY INC3 citations63
US6803657B2Oct 12, 2004

Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components

MICRON TECHNOLOGY INC1 citations63
US6602730B2Aug 5, 2003

Method for gravitation-assisted control of spread of viscous material applied to a substrate

MICRON TECHNOLOGY INC2 citations63
US6489681B2Dec 3, 2002

Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components

MICRON TECHNOLOGY INC1 citations63
US6485778B1Nov 26, 2002

Method of applying an adhesive material to lead fingers of a lead frame

MICRON TECHNOLOGY INC2 citations63
US6336973B1Jan 8, 2002

Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid

MICRON TECHNOLOGY INC3 citations63
US7087116B2Aug 8, 2006

Apparatus for modifying the configuration of an exposed surface of a viscous fluid

MICRON TECHNOLOGY INC0 citations52
US6492713B2Dec 10, 2002

Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components

MICRON TECHNOLOGY INC0 citations52

(unassigned)

1 patent

NEUTRON PRODUCTS INC

1 patent