Inventor

YEH CHENG HUNG

TW19 patents

⚠️ This page may combine multiple inventors who share the name “YEH CHENG HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YEH CHENG HUNG

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structure and method for forming the same

Electromagnetic shielding metal-insulator-metal capacitor structure

Electromagnetic shielding metal-insulator-metal capacitor structure

Method and system for verifying the design of an integrated circuit having multiple tiers

Through-silicon via in integrated circuit packaging

Electromagnetic shielding metal-insulator-metal capacitor structure

Through-silicon vias in integrated circuit packaging

Through-silicon vias in integrated circuit packaging

Systems and methods for determining effective capacitance to facilitate a timing analysis

SOIC chip architecture

Interposer with capacitors

Multi-layer semiconductor structures for fabricating inverter chains

TAIWAN SEMICONDUCTOR MFG

Method and system for semiconductor simulation

Systems and methods for determining effective capacitance to facilitate a timing analysis

System, method, and computer program product for matching cell layout of an integrated circuit design

System, method, and computer program product for matching cell layout of an integrated circuit design

Multi-layer semiconductor structures for fabricating inverter chains

LU LEE-CHUNG

Mask-shift-aware RC extraction for double patterning design

HOU CLIFF

Method of generating technology file for integrated circuit design tools