Inventor

KIM JUM-GON

KR3 patents

⚠️ This page may combine multiple inventors who share the name “KIM JUM-GON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

2 patents

US8735281B2May 27, 2014

Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same

SAMSUNG ELECTRONICS CO LTD1 citations50

US7969024B2Jun 28, 2011

Semiconductor package with joint reliability, entangled wires including insulating material

SAMSUNG ELECTRONICS CO LTD1 citations48

SHIN CHANG-WOO

1 patent

US8456012B2Jun 4, 2013

Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same

SHIN CHANG-WOO2 citations54