Inventor

UZOH CYPRIAN EMEKA

US309 patents

⚠️ This page may combine multiple inventors who share the name “UZOH CYPRIAN EMEKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UZOH CYPRIAN EMEKA

INVENSAS BONDING TECH INC

Molded direct bonded and interconnected stack

Multi-metal contact structure in microelectronic component

Diffusion barrier collar for interconnects

Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics

Die processing

Processed stacked dies

Low temperature bonded structures

Processing stacked substrates

Seal for microelectronic assembly

Systems and methods for efficient transfer of semiconductor elements

Die processing

Stacked dies and methods for forming bonded structures

Large metal pads over TSV

Microelectronic assembly from processed substrate

Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes

Method and structures for low temperature device bonding

Interconnect structures

Techniques for processing devices

Bonded structures

Chemical mechanical polishing for hybrid bonding

Techniques for processing devices

INVENSAS CORP

Direct-bonded LED structure contacts and substrate contacts

Structures and methods for low temperature bonding using nanoparticles

Flat metal features for microelectronics applications

Structures and methods for reliable packages

Interconnect structures and methods for forming same

Structures and methods for reliable packages

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

Multiple bond via arrays of different wire heights on a same substrate

BVA interposer

Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects

Multiple bond via arrays of different wire heights on a same substrate

Compact semiconductor package and related methods

IBM

Copper interconnection structure incorporating a metal seed layer

Integrated circuit spiral inductor

Apparatus and method for the electrochemical etching of a wafer

Method of forming an integrated circuit spiral inductor with ferromagnetic liner

Apparatus for electrochemical mechanical planarization

Integrated circuit inductor

Method of electrochemical mechanical planarization

Integrated circuit toroidal inductor

Copper interconnection structure incorporating a metal seed layer

NUTOOL INC

Method and apparatus for depositing and controlling the texture of a thin film

Chip interconnect and packaging deposition methods and structures

Method and apparatus for plating and polishing a semiconductor substrate

Workpeice proximity plating apparatus

XCELSIS CORP

Systems and methods for releveled bump planes for chiplets

ASM NUTOOL INC

Chip interconnect and packaging deposition methods and structures

HABA BELGACEM

Cavities containing multi-wiring structures and devices

UZOH CYPRIAN EMEKA

Method and apparatus for 3D interconnect