Inventor
KNADLE KEVIN T
US9 patents
⚠️ This page may combine multiple inventors who share the name “KNADLE KEVIN T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS6586683B2Jul 1, 2003
Printed circuit board with mixed metallurgy pads and method of fabrication
IBM15 citations91
US6423905B1Jul 23, 2002
Printed wiring board with improved plated through hole fatigue life
IBM15 citations84
US7596862B2Oct 6, 2009
Method of making a circuitized substrate
IBM8 citations83
US6962642B2Nov 8, 2005
Treating copper surfaces for electronic applications
IBM16 citations82
US6931722B2Aug 23, 2005
Method of fabricating printed circuit board with mixed metallurgy pads
IBM7 citations72
US6822332B2Nov 23, 2004
Fine line circuitization
IBM1 citations61
US7325299B2Feb 5, 2008
Method of making a circuitized substrate
IBM0 citations51
US7185428B2Mar 6, 2007
Method of making a circuitized substrate
IBM0 citations51