Inventor
MCKEVENY JEFFREY
US15 patents
Patents
15 patentsUS6919514B2Jul 19, 2005
Structure having laser ablated features and method of fabricating
IBM157 citations98
US6730857B2May 4, 2004
Structure having laser ablated features and method of fabricating
IBM188 citations98
US5229550AJul 20, 1993
Encapsulated circuitized power core alignment and lamination
IBM170 citations97
US5129142AJul 14, 1992
Encapsulated circuitized power core alignment and lamination
IBM135 citations96
US5578796ANov 26, 1996
Apparatus for laminating and circuitizing substrates having openings therein
IBM69 citations94
US7007378B2Mar 7, 2006
Process for manufacturing a printed wiring board
IBM23 citations92
US6586683B2Jul 1, 2003
Printed circuit board with mixed metallurgy pads and method of fabrication
IBM15 citations91
US5542175AAug 6, 1996
Method of laminating and circuitizing substrates having openings therein
IBM25 citations91
US5866237AFeb 2, 1999
Organic electronic package and method of applying palladium-tin seed layer thereto
IBM27 citations90
US5599747AFeb 4, 1997
Method of making circuitized substrate
IBM31 citations90
US6931722B2Aug 23, 2005
Method of fabricating printed circuit board with mixed metallurgy pads
IBM7 citations72
US7070909B2Jul 4, 2006
UV absorbing glass cloth and use thereof
IBM9 citations71
US6025057AFeb 15, 2000
Organic electronic package and method of applying palladium-tin seed layer thereto
IBM15 citations71
US6485892B1Nov 26, 2002
Method for masking a hole in a substrate during plating
IBM4 citations61
US6838400B1Jan 4, 2005
UV absorbing glass cloth and use thereof
IBM4 citations60