Inventor · disambiguated record
Amit K. Sarkhel
Also filed as: SARKHEL AMIT K · SARKHEL AMIT KUMAR
24 granted patents·1 pending application·755 citations·filing 1995–2003
97Inventor score
Files withIBM24
Top patents by PatentIndex Score
25 records- 0195US6002172ASubstrate structure and method for improving attachment reliability of semiconductor chips and modulesIBM·Filed 1997·Granted Dec 14, 1999·98 cites·6 claims
- 0293US6281581B1Substrate structure for improving attachment reliability of semiconductor chips and modulesIBM·Filed 1999·Granted Aug 28, 2001·70 cites·8 claims
- 0390US6437254B1Apparatus and method for printed circuit board repairIBM·Filed 2001·Granted Aug 20, 2002·46 cites·3 claims
- 0490US5729440ASolder hierarchy for chip attachment to substratesIBM·Filed 1997·Granted Mar 17, 1998·100 cites·5 claims
- 0589US5730932ALead-free, tin-based multi-component solder alloysIBM·Filed 1996·Granted Mar 24, 1998·67 cites·17 claims
- 0688US6433425B1Electronic package interconnect structure comprising lead-free soldersIBM·Filed 2000·Granted Aug 13, 2002·36 cites·16 claims
- 0788US6429388B1High density column grid array connections and method thereofIBM·Filed 2000·Granted Aug 6, 2002·53 cites·14 claims
- 0879US6581821B2Electronic package interconnect structure comprising lead-free soldersIBM·Filed 2002·Granted Jun 24, 2003·18 cites·16 claims
- 0979US5874043ALead-free, high tin ternary solder alloy of tin, silver, and indiumIBM·Filed 1996·Granted Feb 23, 1999·47 cites·5 claims
- 1075US6586683B2Printed circuit board with mixed metallurgy pads and method of fabricationIBM·Filed 2001·Granted Jul 1, 2003·15 cites·15 claims
- 1175US6545229B1Method for producing circuit board assemblies using surface mount components with finely spaced leadsIBM·Filed 2000·Granted Apr 8, 2003·20 cites·6 claims
- 1273US6784086B2Lead-free solder structure and method for high fatigue lifeIBM·Filed 2001·Granted Aug 31, 2004·16 cites·35 claims
- 1373US6010060ALead-free solder processIBM·Filed 1998·Granted Jan 4, 2000·35 cites·5 claims
- 1471US5809641AMethod for printed circuit board repairIBM·Filed 1996·Granted Sep 22, 1998·28 cites·6 claims
- 1570US6251766B1Method for improving attachment reliability of semiconductor chips and modulesIBM·Filed 1999·Granted Jun 26, 2001·23 cites·6 claims
- 1662US6492715B1Integrated semiconductor packageIBM·Filed 2000·Granted Dec 10, 2002·10 cites·9 claims
- 1760US6931722B2Method of fabricating printed circuit board with mixed metallurgy padsIBM·Filed 2003·Granted Aug 23, 2005·7 cites·19 claims
- 1859US6634543B2Method of forming metallic z-interconnects for laminate chip packages and boardsIBM·Filed 2002·Granted Oct 21, 2003·7 cites·17 claims
- 1954US5742483AMethod for producing circuit board assemblies using surface mount components with finely spaced leadsIBM·Filed 1996·Granted Apr 21, 1998·17 cites·6 claims
- 2051US6115912AApparatus and method for printed circuit board repairIBM·Filed 1999·Granted Sep 12, 2000·11 cites·5 claims
- 2150US5655703ASolder hierarchy for chip attachment to substratesIBM·Filed 1995·Granted Aug 12, 1997·14 cites·10 claims
- 2241US6295724B1Apparatus for printed circuit board repairIBM·Filed 1999·Granted Oct 2, 2001·6 cites·6 claims
- 2338US6167615B1Method for producing circuit board assemblies using surface mount components with finely spaced leadsIBM·Filed 1998·Granted Jan 2, 2001·7 cites·2 claims
- 2438US2001002982A1Lead-free, high tin ternary solder alloy of tin, silver, and bismuthFiled 2001·Application pending·0 cites
- 2536US6018866AApparatus and method for printed circuit board repairIBM·Filed 1998·Granted Feb 1, 2000·4 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →