Inventor
SEMAN ANDREW M
US8 patents
Patents
8 patentsUS6586683B2Jul 1, 2003
Printed circuit board with mixed metallurgy pads and method of fabrication
IBM15 citations91
US5189261AFeb 23, 1993
Electrical and/or thermal interconnections and methods for obtaining such
IBM52 citations89
US7596862B2Oct 6, 2009
Method of making a circuitized substrate
IBM8 citations83
US6931722B2Aug 23, 2005
Method of fabricating printed circuit board with mixed metallurgy pads
IBM7 citations72
US6822332B2Nov 23, 2004
Fine line circuitization
IBM1 citations61
US6429390B1Aug 6, 2002
Structure and method for forming the same of a printed wiring board having built-in inspection aids
IBM5 citations55
US7325299B2Feb 5, 2008
Method of making a circuitized substrate
IBM0 citations51
US7185428B2Mar 6, 2007
Method of making a circuitized substrate
IBM0 citations51