P

Inventor

FRIES MANFRED

DE21 patents
⚠️ This page may combine multiple inventors who share the name “FRIES MANFRED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

17 patents
US6347040B1Feb 12, 2002

Sensor device for sensing biometric characteristics, in particular finger minutiae

INFINEON TECHNOLOGIES AG161 citations98
US6848617B1Feb 1, 2005

Smart card module for biometric sensors

INFINEON TECHNOLOGIES AG61 citations96
US7012531B2Mar 14, 2006

Product label, method of producing product labels and method for identifying products in a contactless and forgery-proof manner

INFINEON TECHNOLOGIES AG28 citations92
US6414441B1Jul 2, 2002

Flat carrier with an indicating device

INFINEON TECHNOLOGIES AG39 citations92
US6375083B2Apr 23, 2002

Smart card

INFINEON TECHNOLOGIES AG25 citations92
US6804121B2Oct 12, 2004

Housing for biometric sensor chips and method for producing the housing

INFINEON TECHNOLOGIES AG28 citations91
US6713677B2Mar 30, 2004

Housing assembly for an electronic device and method of packaging an electronic device

INFINEON TECHNOLOGIES AG21 citations87
US7179680B2Feb 20, 2007

Method for producing an optoelectronic component

INFINEON TECHNOLOGIES AG11 citations84
US7868430B2Jan 11, 2011

Semiconductor device

INFINEON TECHNOLOGIES AG7 citations83
US6528723B2Mar 4, 2003

Biometric sensor and method for its production

INFINEON TECHNOLOGIES AG14 citations83
US9748611B2Aug 29, 2017

Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery

INFINEON TECHNOLOGIES AG4 citations73
US10107867B2Oct 23, 2018

Sensor arrangement, battery cell and energy system

INFINEON TECHNOLOGIES AG3 citations72
US6836953B2Jan 4, 2005

Method of producing a biometric sensor

INFINEON TECHNOLOGIES AG7 citations72
US6778407B2Aug 17, 2004

Portable data carrier

INFINEON TECHNOLOGIES AG7 citations70
US6971519B2Dec 6, 2005

Configuration of a flat carrier with a chip module in a padded envelope and method of arranging the configuration

INFINEON TECHNOLOGIES AG4 citations62
US10858245B2Dec 8, 2020

Deposition of protective material at wafer level in front end for early stage particle and moisture protection

INFINEON TECHNOLOGIES AG0 citations51
US10370244B2Aug 6, 2019

Deposition of protective material at wafer level in front end for early stage particle and moisture protection

INFINEON TECHNOLOGIES AG0 citations51

SIEMENS AG

4 patents