Inventor
CHAN ARGUEDAS SERGIO ANTONIO
US13 patents
Patents
13 patentsUS11735552B2Aug 22, 2023
Microelectronic package with solder array thermal interface material (SA-TIM)
INTEL CORP6 citations85
US12238892B2Feb 25, 2025
Immersion cooling for integrated circuit devices
INTEL CORP3 citations72
US11894282B2Feb 6, 2024
Vented lids for integrated circuit packages
INTEL CORP2 citations72
US12272614B2Apr 8, 2025
Integrated circuit packages with solder thermal interface materials with embedded particles
INTEL CORP2 citations70
US12062592B2Aug 13, 2024
Integrated circuit packages with thermal interface materials with different material compositions
INTEL CORP2 citations65
US11682605B2Jun 20, 2023
Integrated circuit packages with asymmetric adhesion material regions
INTEL CORP3 citations65
US12205915B2Jan 21, 2025
Microelectronic package with solder array thermal interface material (SA-TIM)
INTEL CORP0 citations62
US12588499B2Mar 24, 2026
Integrated circuit heat spreader including sealant interface material
INTEL CORP1 citations61
US11791237B2Oct 17, 2023
Microelectronic assemblies including a thermal interface material
INTEL CORP0 citations60
US11798861B2Oct 24, 2023
Integrated heat spreader (IHS) with heating element
INTEL CORP0 citations59
US11817369B2Nov 14, 2023
Lids for integrated circuit packages with solder thermal interface materials
INTEL CORP0 citations58
US11935799B2Mar 19, 2024
Integrated circuit package lids with polymer features
INTEL CORP0 citations54
US12080620B2Sep 3, 2024
Additively manufactured structures for heat dissipation from integrated circuit devices
INTEL CORP0 citations50