Inventor
HOU TE-CHIEN
TW14 patents
Patents
14 patentsUS11529712B2Dec 20, 2022
CMP polishing head design for improving removal rate uniformity
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11069533B2Jul 20, 2021
CMP system and method of use
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10160091B2Dec 25, 2018
CMP polishing head design for improving removal rate uniformity
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12528154B2Jan 20, 2026
Method for conditioning polishing pad
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11389928B2Jul 19, 2022
Method for conditioning polishing pad
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12508685B2Dec 30, 2025
Semiconductor device fabrication methods and devices for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12424449B2Sep 23, 2025
CMP system and method of use
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11984323B2May 14, 2024
CMP system and method of use
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11865666B2Jan 9, 2024
CMP polishing head design for improving removal rate uniformity
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12568786B2Mar 3, 2026
Processing tool and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12581915B2Mar 17, 2026
Apparatus and methods for chemical mechanical polishing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations57
US12447580B2Oct 21, 2025
Apparatus and methods for chemical mechanical polishing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12427618B2Sep 30, 2025
Chemical-mechanical planarization pad and methods of use
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12293917B2May 6, 2025
System and method for removing impurities during chemical mechanical planarization
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51