Inventor
KUO CHENG-YU
TW16 patents
⚠️ This page may combine multiple inventors who share the name “KUO CHENG-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS11069533B2Jul 20, 2021
CMP system and method of use
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10163849B2Dec 25, 2018
Method of manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11569183B2Jan 31, 2023
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12424449B2Sep 23, 2025
CMP system and method of use
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11984323B2May 14, 2024
CMP system and method of use
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12500113B2Dec 16, 2025
Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12441097B2Oct 14, 2025
Lamination process, and manufacturing method of semiconductor package using a chuck
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12391033B2Aug 19, 2025
Lamination process, and manufacturing method of semiconductor package using a chuck
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11993066B2May 28, 2024
Chuck, lamination process, and manufacturing method of semiconductor package using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11069652B2Jul 20, 2021
Method of manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10867939B2Dec 15, 2020
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10535629B2Jan 14, 2020
Method of manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9799625B2Oct 24, 2017
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50