Inventor
GUPTA DEBABRATA
US14 patents
⚠️ This page may combine multiple inventors who share the name “GUPTA DEBABRATA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
5 patentsUS6775150B1Aug 10, 2004
Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
INTEL CORP70 citations96
US7120031B2Oct 10, 2006
Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors
INTEL CORP26 citations92
US7535728B2May 19, 2009
Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors
INTEL CORP8 citations84
US7413936B2Aug 19, 2008
Method of forming copper layers
INTEL CORP3 citations59
US7005727B2Feb 28, 2006
Low cost programmable CPU package/substrate
INTEL CORP4 citations59
MOTOROLA INC
4 patentsUS5198963AMar 30, 1993
Multiple integrated circuit module which simplifies handling and testing
MOTOROLA INC176 citations98
US5341979AAug 30, 1994
Method of bonding a semiconductor substrate to a support substrate and structure therefore
MOTOROLA INC134 citations97
US5567648AOct 22, 1996
Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs
MOTOROLA INC20 citations92
US5451274ASep 19, 1995
Reflow of multi-layer metal bumps
MOTOROLA INC30 citations92