Inventor

ST GERMAIN STEPHEN

US50 patents

⚠️ This page may combine multiple inventors who share the name “ST GERMAIN STEPHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ST GERMAIN STEPHEN

SEMICONDUCTOR COMPONENTS IND LLC

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Semiconductor device and method for supporting ultra-thin semiconductor die

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Semiconductor device and method for supporting ultra-thin semiconductor die

Reducing stress cracks in substrates

Semiconductor device and method for supporting ultra-thin semiconductor die

Structure and method related to a power module using a hybrid spacer

Structure and method related to a power module using a hybrid spacer

Structure and method related to a power module using a hybrid spacer

Semiconductor package structures and methods of manufacture

Semiconductor package structures and methods of manufacture

Semiconductor package structures and methods of manufacture

Semiconductor device and method for supporting ultra-thin semiconductor die

Single or multi chip module package and related methods

Semiconductor devices and methods of making the same

Semiconductor devices and methods of making the same

Holes and dimples to control solder flow

Single or multi chip module package and related methods

Semiconductor devices and methods of making the same

Single or multi chip module package and related methods

Half-bridge HEMT circuit and an electronic package including the circuit

Semiconductor package for a lateral device and related methods

Packaging structure for gallium nitride devices

SEMICONDUCTOR COMPONENTS IND

Encapsulated electronic device structure

Semiconductor device and laminated leadframe package

Semiconductor package structure having multiple heat dissipation paths and method of manufacture

Multi-chip semiconductor connector assemblies

Multi-chip semiconductor connector assembly method

Integrated circuit and laminated leadframe package

Robust power semiconductor package

Multi-chip semiconductor connector and method

Multi-chip semiconductor connector and method

Semiconductor package structure for vertical mount and method

Method of forming a semiconductor package and structure therefor

Encapsulated electronic device

Semiconductor devices and methods of making the same

Semiconductor package for a lateral device and related methods

Multi-chip semiconductor connector assembly method

Semiconductor package

Semiconductor package structure for vertical mount and method

CARNEY FRANCIS J

Multi-chip semiconductor connector

ARBUTHNOT ROGER M

Semiconductor devices and methods of making the same