Inventor

FELDEWERTH GERALD B

US3 patents

⚠️ This page may combine multiple inventors who share the name “FELDEWERTH GERALD B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SONY CORP

1 patent

US6030514AFeb 29, 2000

Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor

SONY CORP55 citations90

INTEL CORP

1 patent

US7064446B2Jun 20, 2006

Under bump metallization layer to enable use of high tin content solder bumps

INTEL CORP29 citations87

JOHNSON MATTHEY ELECT INC

1 patent

US5513834AMay 7, 1996

Preparation of high purity elements

JOHNSON MATTHEY ELECT INC16 citations65