Inventor
PRICE WILLIAM H
US8 patents
⚠️ This page may combine multiple inventors who share the name “PRICE WILLIAM H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
6 patentsUS6133136AOct 17, 2000
Robust interconnect structure
IBM77 citations93
US5098859AMar 24, 1992
Method for forming distributed barrier compound semiconductor contacts
IBM36 citations92
US4796082AJan 3, 1989
Thermally stable ohmic contact for gallium-arsenide
IBM38 citations92
US5427983AJun 27, 1995
Process for corrosion free multi-layer metal conductors
IBM21 citations90
US4849802AJul 18, 1989
Thermally stable low resistance contact
IBM11 citations74
US5483105AJan 9, 1996
Module input-output pad having stepped set-back
IBM5 citations62