Inventor
TOYODA YOSHIHIKO
JP17 patents
Patents
17 patentsUS6184124B1Feb 6, 2001
Method of making embedded wiring system
MITSUBISHI ELECTRIC CORP50 citations95
US6107687AAug 22, 2000
Semiconductor device having interconnection and adhesion layers
MITSUBISHI ELECTRIC CORP63 citations95
US6605861B2Aug 12, 2003
Semiconductor device
MITSUBISHI ELECTRIC CORP43 citations92
US6503376B2Jan 7, 2003
Electroplating apparatus
MITSUBISHI ELECTRIC CORP33 citations92
US6335570B2Jan 1, 2002
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP26 citations92
US6215189B1Apr 10, 2001
Semiconductor device having interconnect layer and method of manufacturing therefor
MITSUBISHI ELECTRIC CORP32 citations92
US6039808AMar 21, 2000
CVD apparatus for Cu formation
MITSUBISHI ELECTRIC CORP32 citations92
US5892286AApr 6, 1999
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP45 citations92
US5793112AAug 11, 1998
Multilevel embedded wiring system
MITSUBISHI ELECTRIC CORP42 citations92
US6417534B2Jul 9, 2002
Semiconductor device and method of fabricating the same
MITSUBISHI ELECTRIC CORP18 citations84
US7612378B2Nov 3, 2009
Semiconductor device with multiple impurity regions and image display apparatus
MITSUBISHI ELECTRIC CORP10 citations79
US7176491B2Feb 13, 2007
Semiconductor device
MITSUBISHI ELECTRIC CORP6 citations74
US9988738B2Jun 5, 2018
Method for manufacturing SiC epitaxial wafer
MITSUBISHI ELECTRIC CORP3 citations71
US7396707B2Jul 8, 2008
Fabrication method of a semiconductor device
MITSUBISHI ELECTRIC CORP4 citations63
US7262433B2Aug 28, 2007
Semiconductor device
MITSUBISHI ELECTRIC CORP6 citations63
US6667530B2Dec 23, 2003
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP6 citations62
US6303495B2Oct 16, 2001
Method of forming thin copper film and semiconductor device with thin copper film
MITSUBISHI ELECTRIC CORP4 citations62